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XCKU035-1FBVA676C AMD (Xilinx) Kintex UltraScale FPGA 355K Logic Cells 312 I/O 16 GTH 676-FBGA Commercial XCKU035-1FBVA676C AMD Kintex UltraScale FPGA 355K Logic Cells 312 I/O Commercial
XCKU035-1FBVA676C AMD (Xilinx) Kintex UltraScale FPGA 355K Logic Cells 312 I/O 16 GTH 676-FBGA Commercial XCKU035-1FBVA676C AMD Kintex UltraScale FPGA 355K Logic Cells 312 I/O Commercial
XCKU035-1FBVA676C AMD (Xilinx) Kintex UltraScale FPGA 355K Logic Cells 312 I/O 16 GTH 676-FBGA Commercial XCKU035-1FBVA676C AMD Kintex UltraScale FPGA 355K Logic Cells 312 I/O Commercial
XCKU035-1FBVA676C AMD (Xilinx) Kintex UltraScale FPGA 355K Logic Cells 312 I/O 16 GTH 676-FBGA Commercial XCKU035-1FBVA676C AMD Kintex UltraScale FPGA 355K Logic Cells 312 I/O Commercial
XCKU035-1FBVA676C AMD (Xilinx) Kintex UltraScale FPGA 355K Logic Cells 312 I/O 16 GTH 676-FBGA Commercial XCKU035-1FBVA676C AMD Kintex UltraScale FPGA 355K Logic Cells 312 I/O Commercial
XCKU035-1FBVA676C AMD (Xilinx) Kintex UltraScale FPGA 355K Logic Cells 312 I/O 16 GTH 676-FBGA Commercial XCKU035-1FBVA676C AMD Kintex UltraScale FPGA 355K Logic Cells 312 I/O Commercial
XCKU035-1FBVA676C AMD (Xilinx) Kintex UltraScale FPGA 355K Logic Cells 312 I/O 16 GTH 676-FBGA Commercial XCKU035-1FBVA676C AMD Kintex UltraScale FPGA 355K Logic Cells 312 I/O Commercial
XCKU035-1FBVA676C AMD (Xilinx) Kintex UltraScale FPGA 355K Logic Cells 312 I/O 16 GTH 676-FBGA Commercial XCKU035-1FBVA676C AMD Kintex UltraScale FPGA 355K Logic Cells 312 I/O Commercial
XCKU035-1FBVA676C AMD (Xilinx) Kintex UltraScale FPGA 355K Logic Cells 312 I/O 16 GTH 676-FBGA Commercial XCKU035-1FBVA676C AMD Kintex UltraScale FPGA 355K Logic Cells 312 I/O Commercial
XCKU035-1FBVA676C AMD (Xilinx) Kintex UltraScale FPGA 355K Logic Cells 312 I/O 16 GTH 676-FBGA Commercial XCKU035-1FBVA676C AMD Kintex UltraScale FPGA 355K Logic Cells 312 I/O Commercial
XCKU035-1FBVA676C AMD (Xilinx) Kintex UltraScale FPGA 355K Logic Cells 312 I/O 16 GTH 676-FBGA Commercial XCKU035-1FBVA676C AMD Kintex UltraScale FPGA 355K Logic Cells 312 I/O Commercial
XCKU035-1FBVA676C AMD (Xilinx) Kintex UltraScale FPGA 355K Logic Cells 312 I/O 16 GTH 676-FBGA Commercial XCKU035-1FBVA676C AMD Kintex UltraScale FPGA 355K Logic Cells 312 I/O Commercial
XCKU035-1FBVA676C AMD (Xilinx) Kintex UltraScale FPGA 355K Logic Cells 312 I/O 16 GTH 676-FBGA Commercial XCKU035-1FBVA676C AMD Kintex UltraScale FPGA 355K Logic Cells 312 I/O Commercial
XCKU035-1FBVA676C AMD (Xilinx) Kintex UltraScale FPGA 355K Logic Cells 312 I/O 16 GTH 676-FBGA Commercial XCKU035-1FBVA676C AMD Kintex UltraScale FPGA 355K Logic Cells 312 I/O Commercial
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XCKU035-1FBVA676C AMD (Xilinx) Kintex UltraScale FPGA 355K Logic Cells 312 I/O 16 GTH 676-FBGA Commercial

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XCKU035-1FBVA676C Product Overview

The XCKU035-1FBVA676C is a Field Programmable Gate Array (FPGA) from AMD (formerly Xilinx), part of the Kintex UltraScale family, housed in a 676-pin FBGA (FBVA676) package and manufactured using 20nm process technology. The device provides 355K logic cells and 158K LUTs, integrates 19.0Mb of Block RAM, and features 312 user I/O pins. The chip incorporates 16 GTH high-speed transceivers, each running at up to 16.3Gbps, and supports PCIe 3.0 high-speed interfaces. Its core voltage is 0.95V, with I/O voltage supporting 1.0V to 3.3V, and it operates over a commercial temperature range of 0°C to +85°C. This device uses speed grade -1, offering an excellent balance between performance, power, and cost, making it suitable for mid-to-high-end applications requiring high logic capacity, high-speed serial connectivity, and advanced signal processing. XCKU035-1FBVA676C is a versatile and dependable FPGA.


XCKU035-1FBVA676C Core Features

Logic Resources: 355K logic cells, 158K LUTs, 317K flip-flops

On-Chip Memory: 19.0Mb Block RAM, supporting FIFO and ECC

User I/O: 312 user I/O pins supporting various single-ended and differential standards

High-Speed Transceivers: 16 GTH transceivers, each up to 16.3Gbps

DSP Capability: 1700 DSP Slices for efficient digital signal processing

Clock Management: Integrated MMCM and PLL units for high-precision clock synthesis

Interface Support: PCIe 3.0 high-speed interface, DDR4 memory up to 2400Mb/s

Operating Conditions: Core voltage 0.95V, I/O voltage 1.0V-3.3V, commercial 0°C to +85°C

Package: 676-pin FBGA (27x27mm), surface mount, RoHS compliant

XCKU035-1FBVA676C is designed for robust performance.


XCKU035-1FBVA676C Applications

Wireless Communications: XCKU035-1FBVA676C can be used in 5G base stations, remote radio units, and microwave backhaul equipment for digital front-end processing.

Wired Communications: XCKU035-1FBVA676C is suitable for optical transport networks, multi-channel protocol conversion, and high-speed data acquisition cards.

Video Broadcasting: XCKU035-1FBVA676C supports multi-channel 4K/8K video processing and broadcast-grade image enhancement.

Industrial Control: XCKU035-1FBVA676C can execute complex motion control algorithms, multi-axis robot controllers, and industrial Ethernet protocol processing.

Medical Imaging: XCKU035-1FBVA676C accelerates signal acquisition and image reconstruction in ultrasound and CT equipment.

Data Center: XCKU035-1FBVA676C is suitable for network acceleration, storage controllers, and hardware offload engines.


XCKU035-1FBVA676C Key Advantages

High Performance-per-Watt: With 20nm process, total power is significantly lower than 28nm generation, providing better power efficiency at comparable performance.

Integrated High-Speed Transceivers: Built-in 16 GTH transceivers at 16.3Gbps and PCIe 3.0 hard core enable multi-channel high-speed serial communication without external PHY chips.

Rich DSP Resources: 1700 DSP Slices efficiently execute FFT, FIR filtering, and other operations, meeting the real-time computing needs of wireless communications and image processing.

Flexible I/O Support: 312 user I/O pins support DDR4 interfaces and multiple level standards, adapting to various peripherals and bus protocols, enhancing system integration flexibility.

Mature Development Ecosystem: Supports AMD (Xilinx) Vivado development tools and MicroBlaze soft processor, with rich IP core resources to accelerate product development.

Commercial-Grade Value: Operating temperature range of 0°C to +85°C suits most commercial and controlled-environment embedded systems.


Why Choose QIXINWEI

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Contact us for BOM quotes or PCBA inquiries.


XCKU035-1FBVA676C AMD (Xilinx) Kintex UltraScale FPGA 355K Logic Cells 312 I/O 16 GTH 676-FBGA Commercial XCKU035-1FBVA676C AMD Kintex UltraScale FPGA 355K Logic Cells 312 I/O CommercialXCKU035-1FBVA676C AMD (Xilinx) Kintex UltraScale FPGA 355K Logic Cells 312 I/O 16 GTH 676-FBGA Commercial XCKU035-1FBVA676C AMD Kintex UltraScale FPGA 355K Logic Cells 312 I/O CommercialXCKU035-1FBVA676C AMD (Xilinx) Kintex UltraScale FPGA 355K Logic Cells 312 I/O 16 GTH 676-FBGA Commercial XCKU035-1FBVA676C AMD Kintex UltraScale FPGA 355K Logic Cells 312 I/O CommercialXCKU035-1FBVA676C AMD (Xilinx) Kintex UltraScale FPGA 355K Logic Cells 312 I/O 16 GTH 676-FBGA Commercial XCKU035-1FBVA676C AMD Kintex UltraScale FPGA 355K Logic Cells 312 I/O CommercialXCKU035-1FBVA676C AMD (Xilinx) Kintex UltraScale FPGA 355K Logic Cells 312 I/O 16 GTH 676-FBGA Commercial XCKU035-1FBVA676C AMD Kintex UltraScale FPGA 355K Logic Cells 312 I/O CommercialXCKU035-1FBVA676C AMD (Xilinx) Kintex UltraScale FPGA 355K Logic Cells 312 I/O 16 GTH 676-FBGA Commercial XCKU035-1FBVA676C AMD Kintex UltraScale FPGA 355K Logic Cells 312 I/O CommercialXCKU035-1FBVA676C AMD (Xilinx) Kintex UltraScale FPGA 355K Logic Cells 312 I/O 16 GTH 676-FBGA Commercial XCKU035-1FBVA676C AMD Kintex UltraScale FPGA 355K Logic Cells 312 I/O CommercialXCKU035-1FBVA676C AMD (Xilinx) Kintex UltraScale FPGA 355K Logic Cells 312 I/O 16 GTH 676-FBGA Commercial XCKU035-1FBVA676C AMD Kintex UltraScale FPGA 355K Logic Cells 312 I/O CommercialXCKU035-1FBVA676C AMD (Xilinx) Kintex UltraScale FPGA 355K Logic Cells 312 I/O 16 GTH 676-FBGA Commercial XCKU035-1FBVA676C AMD Kintex UltraScale FPGA 355K Logic Cells 312 I/O CommercialXCKU035-1FBVA676C AMD (Xilinx) Kintex UltraScale FPGA 355K Logic Cells 312 I/O 16 GTH 676-FBGA Commercial XCKU035-1FBVA676C AMD Kintex UltraScale FPGA 355K Logic Cells 312 I/O CommercialXCKU035-1FBVA676C AMD (Xilinx) Kintex UltraScale FPGA 355K Logic Cells 312 I/O 16 GTH 676-FBGA Commercial XCKU035-1FBVA676C AMD Kintex UltraScale FPGA 355K Logic Cells 312 I/O Commercial


FAQ

  1. What is the difference between XCKU035-1FBVA676C and the Kintex-7 series?
    • Kintex UltraScale uses 20nm process, offering higher performance and lower power than 28nm Kintex-7.
    • XCKU035-1FBVA676C provides more logic cells (355K) and higher DSP count (1700), suitable for more complex designs.
  2. How many high-speed transceivers does this chip have? What is the rate?
    • It has 16 GTH high-speed transceivers, each capable of up to 16.3Gbps.
    • These can be used for optical communications, PCIe data links, and multi-channel high-speed serial interfaces.
  3. What external memory interfaces does it support?
    • It supports DDR4 memory interfaces with data rates up to 2400Mb/s, also backward compatible with DDR3.
    • It is typically paired with large-capacity DDR4 and QSPI Flash for high-performance caching.
  4. What interface standards do the 312 I/O pins support?
    • It supports various single-ended and differential standards, including LVTTL, LVCMOS, SSTL, and LVDS.
    • The I/O voltage range is 1.0V to 3.3V, accommodating different system level requirements.
  5. Does this device support PCIe interfaces?
    • Yes, it supports PCIe 3.0 with multi-lane high-speed data transfer capability.
    • The PCIe hard core is integrated in the chip, eliminating the need for external PHY devices and simplifying design.
  6. What tools and software are needed for development?
    • Use AMD (Xilinx)'s official Vivado development suite for design, synthesis, and implementation.
    • Hardware debugging can be performed via JTAG for in-circuit configuration and debugging, supporting MicroBlaze soft processor development.
  7. What does the -1 speed grade mean?
    • The Kintex UltraScale series offers -1, -2, and -3 speed grades, with -3 being the highest performance.
    • -1 is the base speed grade, suitable for most commercial and controlled-environment applications.
  8. What is the operating temperature range of this chip?
    • The commercial temperature range is 0°C to +85°C (junction temperature).
    • Suitable for most commercial and controlled-environment embedded systems.
  9. What is the power consumption profile?
    • With 20nm process, static power is significantly lower than 28nm predecessor.
    • Total power is lower than 28nm devices, providing better power efficiency at comparable performance.
  10. What are the upgrade options if I need higher performance?
    • Consider Kintex UltraScale+ series for higher logic density and richer transceiver resources.
    • For lower power, choose the -2L speed grade, which supports lower core voltage to reduce dynamic power.
Property:
Specification
Product Type:
Field Programmable Gate Array (FPGA)
Brand:
AMD (formerly Xilinx)
Series:
Kintex UltraScale
Logic Cells:
355K
LUTs:
158K
Flip-Flops:
317K
Total RAM Bits:
19.0Mb Block RAM
User I/O:
312
High-Speed Transceivers:
16 GTH, up to 16.3Gbps
DSP Slices:
1700
Speed Grade:
-1
Core Voltage:
0.95V
I/O Voltage:
1.0V - 3.3V
Operating Temperature:
0°C to +85°C (Commercial)
Package:
676-FBGA (27x27mm)
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