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XC7A200T-2FBG676C AMD (Xilinx) Artix-7 FPGA 215360 Logic Cells 400 I/O 676-FBGA Commercial
XC7A200T-2FBG676C Product Overview
The XC7A200T-2FBG676C is a Field Programmable Gate Array (FPGA) from AMD (formerly Xilinx), part of the Artix-7 family, housed in a 676-pin FBGA (FBG676) package and manufactured using 28nm high-k metal gate (HKMG) process technology. XC7A200T-2FBG676C provides 215,360 logic cells and 33,650 CLBs, integrates 13.1Mb of Block RAM, and features 400 user I/O pins. XC7A200T-2FBG676C incorporates 16 GTP high-speed transceivers, each running at up to 6.6Gbps, and supports PCIe 2.0 high-speed interfaces. XC7A200T-2FBG676C core voltage ranges from 0.95V to 1.05V, with I/O voltage supporting 1.2V to 3.3V, and it operates over a commercial temperature range of 0°C to +85°C. This device uses speed grade -2, offering an excellent balance between high performance and low power, making it suitable for embedded applications requiring high logic density and multiple high-speed serial connections. XC7A200T-2FBG676C is a versatile and dependable FPGA.
XC7A200T-2FBG676C Core Features
Logic Resources: XC7A200T-2FBG676C provides 215,360 logic cells, 33,650 CLBs, 67,300 Slices
On-Chip Memory: XC7A200T-2FBG676C integrates 13.1Mb Block RAM, supporting FIFO and ECC
User I/O: XC7A200T-2FBG676C features 400 user I/O pins supporting various single-ended and differential standards
High-Speed Transceivers: XC7A200T-2FBG676C includes 16 GTP transceivers, each up to 6.6Gbps
DSP Capability: XC7A200T-2FBG676C contains 740 DSP Slices for efficient digital signal processing
Clock Management: XC7A200T-2FBG676C integrates MMCM and PLL units for high-precision clock synthesis
Interface Support: XC7A200T-2FBG676C supports PCIe 2.0 high-speed interface, DDR3 memory up to 1866Mb/s
Operating Conditions: XC7A200T-2FBG676C core voltage 0.95V-1.05V, I/O voltage 1.2V-3.3V, commercial 0°C to +85°C
Package: XC7A200T-2FBG676C uses a 676-pin FBGA (27x27mm), surface mount, RoHS compliant
XC7A200T-2FBG676C is designed for robust performance.
XC7A200T-2FBG676C Applications
Software-Defined Radio (SDR): XC7A200T-2FBG676C is used in multi-channel wireless base stations, wideband spectrum monitoring, cognitive radio systems
Machine Vision: XC7A200T-2FBG676C is applied in high-resolution industrial cameras, multi-camera image processing, real-time vision inspection systems
Wired/Wireless Communications: XC7A200T-2FBG676C is found in optical transport networks, multi-channel protocol conversion, high-speed data acquisition cards
Industrial Control: XC7A200T-2FBG676C supports complex motion control, multi-axis robot controllers, industrial Ethernet switches
Video Processing: XC7A200T-2FBG676C enables 4K video capture and processing, multi-channel video stitching, broadcast-grade image enhancement
Data Center: XC7A200T-2FBG676C is used in network acceleration, storage controllers, hardware offload engines
XC7A200T-2FBG676C Key Advantages
High Logic Density: XC7A200T-2FBG676C provides 215,360 logic cells, making it one of the largest devices in the Artix-7 family, accommodating complex digital system designs.
Rich Transceiver Resources: XC7A200T-2FBG676C features built-in 16 GTP transceivers at 6.6Gbps supporting multi-channel high-speed serial interconnects without external PHY chips.
Powerful DSP Capability: XC7A200T-2FBG676C includes 740 DSP Slices that efficiently execute FFT, FIR, and multi-channel filtering, meeting wireless and image processing needs.
Flexible I/O Support: XC7A200T-2FBG676C offers 400 user I/O pins supporting DDR3 interfaces and multiple level standards, adapting to various peripherals and bus protocols.
Mature Development Ecosystem: XC7A200T-2FBG676C supports AMD (Xilinx) Vivado development tools and MicroBlaze soft processor, with rich IP core resources to accelerate time-to-market.
Commercial-Grade Value: XC7A200T-2FBG676C operating temperature range of 0°C to +85°C suits most commercial and industrial applications, providing a cost-effective solution.
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FAQ
- What is the difference between XC7A200T-2FBG676C and XC7A100T?
- XC7A200T-2FBG676C has more logic cells (215,360 vs. 101,440), suitable for more complex system designs.
- XC7A200T-2FBG676C features 16 GTP transceivers, while XC7A100T has only 4, making it ideal for multi-channel high-speed serial applications.
- How many high-speed transceivers does this chip have? What is the rate?
- XC7A200T-2FBG676C has 16 GTP high-speed transceivers, each capable of up to 6.6Gbps.
- These can be used for optical communications, PCIe data links, and multi-channel high-speed serial interfaces.
- What external memory interfaces does it support?
- XC7A200T-2FBG676C supports DDR3 memory interfaces with data rates up to 1866Mb/s.
- It is typically paired with large-capacity DDR3 and QSPI Flash for high-performance caching.
- What interface standards do the 400 I/O pins support?
- XC7A200T-2FBG676C supports various single-ended and differential standards, including LVTTL, LVCMOS, SSTL, and LVDS.
- The I/O voltage range is 1.2V to 3.3V, accommodating different system level requirements.
- Does this device support PCIe interfaces?
- Yes, XC7A200T-2FBG676C supports PCIe 2.0 with multi-lane high-speed data transfer capability.
- The PCIe hard core is integrated in XC7A200T-2FBG676C, eliminating the need for external PHY devices and simplifying design.
- What tools and software are needed for development?
- Use AMD (Xilinx)'s official Vivado development suite to design, synthesize, and implement XC7A200T-2FBG676C.
- Hardware debugging can be performed via JTAG for in-circuit configuration and debugging, supporting MicroBlaze soft processor development.
- What does the -2 speed grade mean?
- The Artix-7 series offers -1, -2, and -3 speed grades, with -3 being the highest performance.
- XC7A200T-2FBG676C uses -2 as the mid-range speed grade, suitable for most industrial and commercial applications.
- What is the operating temperature range of this chip?
- XC7A200T-2FBG676C commercial temperature range is 0°C to +85°C (junction temperature).
- Suitable for most commercial and controlled-environment embedded systems.
- What is the power consumption profile?
- XC7A200T-2FBG676C with 28nm HKMG process has significantly lower static power than 45nm predecessor.
- Total power of XC7A200T-2FBG676C is 50% lower than 45nm devices, providing better power efficiency at comparable performance.
- What are the upgrade options if I need higher performance?
- Consider Kintex-7 or Virtex-7 series for higher logic density and richer transceiver resources than XC7A200T-2FBG676C.
- For lower power, choose the -2L speed grade of Artix-7, which supports 0.9V core voltage to reduce dynamic power.
- Property:
- Specification
- Product Type:
- Field Programmable Gate Array (FPGA)
- Brand:
- AMD (formerly Xilinx)
- Series:
- Artix-7
- Logic Cells:
- 215360
- LABs/CLBs:
- 33650
- Total RAM Bits:
- 13.1 Mb (13140 Kbits)
- User I/O:
- 400
- High-Speed Transceivers:
- 16 GTP, up to 6.6Gbps
- DSP Slices:
- 740
- Speed Grade:
- -2
- Core Voltage:
- 0.95V - 1.05V
- I/O Voltage:
- 1.2V - 3.3V
- Operating Temperature:
- 0°C to +85°C (Commercial)
- Package:
- 676-FBGA (27x27mm)