qixinwei-pcba
TWSC TEMCG101T30-A0S5 64GB eMMC Embedded Flash Storage Chip BGA153
TEMCG101T30-A0S5 Product Overview
The TWSC TEMCG101T30-A0S5 is a 64GB eMMC flash storage chip, independently developed and manufactured by TWSC, a leading domestic storage controller chip company. The TEMCG101T30-A0S5 features an FBGA153 standard package, complies with the JEDEC eMMC 5.1 mainstream specification, supports HS400 high-speed mode, and offers broad compatibility with mainstream platforms. As one of the few domestic manufacturers with integrated capabilities in self-developed controller chips, firmware solutions, and storage module assembly, TWSC provides customers with one-stop, full-link storage solutions from chip-level algorithm development to terminal application adaptation. The TEMCG101T30-A0S5 is widely used in smartphones, tablets, smart TV boxes, set-top boxes, automotive electronics, security surveillance, and other embedded intelligent terminal devices.
TEMCG101T30-A0S5 Key Features
Large Storage Capacity: The TEMCG101T30-A0S5 provides 64GB storage capacity to meet the demands of operating systems, applications, and user data.
eMMC 5.1 Standard: The TEMCG101T30-A0S5 complies with JEDEC eMMC 5.1 mainstream specification, supporting HS400 high-speed mode with backward compatibility to HS200.
FBGA153 Package: The TEMCG101T30-A0S5 features an FBGA153 standard package, 11.5×13mm, 0.5mm pitch, RoHS compliant.
SLC Cache Architecture: The TEMCG101T30-A0S5 adopts SLC cache architecture for write stability assurance.
Broad Platform Compatibility: The TEMCG101T30-A0S5 is highly compatible with mainstream platforms, supporting Field Firmware Update (FFU).
High Reliability: The TEMCG101T30-A0S5 incorporates built-in high-reliability flash management mechanisms to ensure data integrity and storage lifespan.
Domestically Developed: TWSC possesses integrated capabilities in chip design, firmware development, packaging, testing, and manufacturing of the TEMCG101T30-A0S5.
Full-Link Solutions: The TEMCG101T30-A0S5 provides one-stop, full-link storage solutions from chip-level algorithm development to terminal application adaptation.
TEMCG101T30-A0S5 Applications
The TEMCG101T30-A0S5 is widely used in the following fields:
Smartphones and Tablets: The TEMCG101T30-A0S5 serves as the main storage chip for mobile terminals
Smart TVs and Set-Top Boxes: The TEMCG101T30-A0S5 provides system storage for home entertainment devices
Networking Products: The TEMCG101T30-A0S5 is used in routers, gateways, and other network communication devices
Video Surveillance: The TEMCG101T30-A0S5 enables data storage for security monitoring systems
Automotive Electronics: The TEMCG101T30-A0S5 is suitable for in-vehicle infotainment systems, instrument clusters
Industrial Control: The TEMCG101T30-A0S5 is used in embedded industrial control systems
Smart Wearables: The TEMCG101T30-A0S5 is designed into smart watches, bands, and other wearable devices
Consumer Electronics: The TEMCG101T30-A0S5 is found in e-book readers, digital cameras, voice recorders, MP3/MP4 players, etc.
TEMCG101T30-A0S5 Key Advantages
Large Storage Capacity: The TEMCG101T30-A0S5's 64GB capacity meets the storage demands of mainstream smart devices, easily accommodating operating systems, various applications, and user data.
eMMC 5.1 High-Speed Standard: The TEMCG101T30-A0S5 complies with the eMMC 5.1 mainstream specification with HS400 high-speed mode support for excellent data transfer performance.
FBGA153 Standard Package: The TEMCG101T30-A0S5 comes in an industry-standard FBGA153 package, 11.5×13mm compact design with perfect compatibility with mainstream platforms.
SLC Cache Architecture: The TEMCG101T30-A0S5's SLC cache architecture ensures write stability and data reliability.
Broad Platform Compatibility: The TEMCG101T30-A0S5 is highly compatible with mainstream platforms with FFU support for convenient product maintenance and upgrades.
Full Industry Chain Self-Sufficiency: TWSC is a leading domestic storage controller chip company with full industry chain capabilities from chip design, packaging, and module manufacturing to the TEMCG101T30-A0S5.
Mature Mass Production Experience: TWSC has achieved full independent mass production of eMMC/UFS embedded storage controllers, covering consumer-grade to industrial-grade full-category storage products, including the TEMCG101T30-A0S5.
Diverse Application Scenarios: The TEMCG101T30-A0S5 is widely used in mobile phones, tablets, automotive electronics, data centers, security surveillance, and other diverse scenarios.
Why Choose QIXINWEI
Years of experience in the electronics industry. Trusted by global customers.
Massive In-Stock Inventory – Ready to ship promptly
BOM Matching Service – One-stop solution, save time
PCBA Customization – Professional engineering team creates tailor-made solutions based on your needs
Cost-Effective & Efficient – Better channel, better cost
A dedicated team makes your procurement smoother.
Contact us for BOM quotes or PCBA inquiries
FAQ1. What is TEMCG101T30-A0S5?
The TEMCG101T30-A0S5 is an eMMC storage chip from TWSC. It integrates NAND flash and a controller into a single BGA package, providing a standardized storage solution for embedded systems.
2. What are the key specifications?
Key specifications of the TEMCG101T30-A0S5 are as follows:
Storage Capacity: 64GB
Flash Interface: eMMC 5.1
Operating Voltage: VCC=3.3V, VCCQ=1.8V or 3.3V
Package: FBGA153
3. What package does it use?
The TEMCG101T30-A0S5 uses an FBGA153 (Ball Grid Array) package. This is a 153-ball FBGA package, typically measuring 11.5mm × 13.0mm.
4. What applications is it suitable for?
The TEMCG101T30-A0S5 is widely used in various embedded devices, including:
Smartphones and Tablets
Set-top boxes and Smart TVs
Industrial control and IoT devices
Automotive infotainment systems
Security surveillance and Wearable devices
5. What development tools support it?
As a standard eMMC storage chip, the TEMCG101T30-A0S5 requires no dedicated software tools. Host platforms have built-in eMMC controller drivers, and the system can directly recognize and manage it.
6. What is the operating temperature range?
TWSC eMMC products are typically available in different temperature grades:
Consumer Grade: -25°C to +85°C
Industrial Grade: -40°C to +85°C
7. What are the key features?
High Integration: The TEMCG101T30-A0S5 combines flash memory and controller in a single chip, simplifying system design
Standardized Interface: The TEMCG101T30-A0S5 complies with JEDEC eMMC 5.1 standards for strong compatibility
High-Speed Mode: The TEMCG101T30-A0S5 supports HS400 high-speed mode, backward compatible with HS200
SLC Cache Architecture: The TEMCG101T30-A0S5 ensures write stability with its SLC cache
Remote Firmware Update: The TEMCG101T30-A0S5 supports FFU (Field Firmware Update)
8. What interfaces does it support?
Host Interface: The TEMCG101T30-A0S5 complies with the eMMC 5.1 standard protocol
The TEMCG101T30-A0S5 supports HS400 high-speed mode, with interface speeds up to 400MB/s
Package: 153-ball FBGA
9. What are the alternative models?
TWSC same-series eMMC models: TEMCG105T10-A8S5
Other brand compatible models: RS70B64G4M05G (Jingcun), KS81AAC0 (Kangxinwei), etc.
10. What are the design considerations?
Pin Compatibility: BGA package pin definitions should be confirmed with the official datasheet for the TEMCG101T30-A0S5
PCB Layout: High-speed signal traces require impedance matching and length control
Power Decoupling: Proper decoupling capacitors should be placed near VCC and VCCQ pins of the TEMCG101T30-A0S5
Voltage Selection: The TEMCG101T30-A0S5 supports VCCQ at both 1.8V and 3.3V
Temperature Grade Confirmation: Select consumer or industrial grade based on the application environment for the TEMCG101T30-A0S5
- Model:
- E64GCH9T1ABE00
- Brand:
- TWSC
- Memory Type:
- eMMC
- Storage Capacity:
- 64GB
- Protocol Standard:
- eMMC
- Product Type:
- Embedded Storage Chip
- Package:
- BGA
- Application:
- Smartphones, Tablets, Automotive, Security, STBs, etc.
