TMS320VC5510AZGWA2 TI TMS320C55x Industrial 16-Bit Fixed-Point DSP 200MHz 64KB ROM 256KB SRAM 3xMcBSP HPI BGA-176

TMS320VC5510AZGWA2 Product Overview

The TMS320VC5510AZGWA2 is a high-performance, low-power 16-bit fixed-point digital signal processor (DSP) from Texas Instruments' C55x family, operating at 200MHz (200 MIPS / 400 MMACS) in a 176-ball MicroStar BGA (ZGW) package. Rated for the industrial temperature range of -40°C to +85°C, the TMS320VC5510AZGWA2 integrates 64KB of mask ROM and 256KB of zero-wait-state SRAM (128KB DARAM + 128KB SARAM), providing substantial on-chip storage for complex algorithms and real-time data. The TMS320VC5510AZGWA2’s rich peripherals include three high-speed multi-channel buffered serial ports (McBSP), a 16-bit enhanced host port interface (HPI), two general-purpose timers, and an efficient 8-channel DMA controller. With dual MAC units and an optimized low-power design, the TMS320VC5510AZGWA2 is ideal for high-density fixed-point processing in industrial signal monitoring, multi-channel digital communication, professional audio, and portable instrumentation. The TMS320VC5510AZGWA2 is fully supported by TI's free Code Composer Studio IDE and C55x DSPLIB, significantly reducing development time.

TMS320VC5510AZGWA2 Core Features

Processor Core: The TMS320VC5510AZGWA2 features a 16-bit C55x fixed-point DSP, 200MHz (200 MIPS, 400 MMACS), dual MAC, low-power architecture

On-Chip Memory: The TMS320VC5510AZGWA2 integrates 32K×16 mask ROM (64KB), 64K×16 DARAM (128KB), 64K×16 SARAM (128KB) – total 256KB zero-wait-state SRAM

DMA Controller: The TMS320VC5510AZGWA2 includes an 8-channel DMA for autonomous data movement between peripherals and memory

McBSP: The TMS320VC5510AZGWA2 provides 3 high-speed multi-channel buffered serial ports, I2S/TDM/PCM compatible

HPI: The TMS320VC5510AZGWA2 offers a 16-bit enhanced host port interface for direct memory access by an external host

Timers: The TMS320VC5510AZGWA2 contains 2 general-purpose timers

System: The TMS320VC5510AZGWA2 features an on-chip programmable PLL and multiple power-down modes for low power

Temperature Range: The TMS320VC5510AZGWA2 operates in the industrial temperature range, -40°C to +85°C

Package: The TMS320VC5510AZGWA2 is housed in a 176-ball MicroStar BGA (ZGW), 0.8mm pitch

TMS320VC5510AZGWA2 Applications

Industrial Signal Processing: The TMS320VC5510AZGWA2 excels in vibration spectrum analysis, acoustic monitoring, ultrasonic processing, and industrial sensor network nodes

Digital Communication: The TMS320VC5510AZGWA2 is well-suited for multi-channel wireless baseband, software-defined radio front-ends, and power line communication

Professional Audio: The TMS320VC5510AZGWA2 can be used in digital mixers, audio effects, multi-track recording, and conferencing system audio processing

Portable Instrumentation: The TMS320VC5510AZGWA2 supports battery-powered devices requiring wide temperature, portable medical instruments, and field test & data acquisition

TMS320VC5510AZGWA2 Key Advantages

Industrial-Grade Reliability: The TMS320VC5510AZGWA2 delivers stable operation across the -40°C to +85°C range, making it ideal for factory floors, outdoor cabinets, and demanding environments.

Balanced Memory Architecture: The TMS320VC5510AZGWA2 provides 128KB DARAM + 128KB SARAM, offering ample zero-wait-state space for code, data tables, and heavy buffering without external memory overhead.

Triple McBSP for Multi-Channel I/O: With the TMS320VC5510AZGWA2, you can simultaneously connect multiple audio codecs, high-speed ADCs/DACs, or communication front-ends for versatile multi-channel systems.

Flexible HPI Integration: The TMS320VC5510AZGWA2’s 16-bit HPI lets an external MCU or ARM host transparently access DSP memory, enabling clean co-processor architectures.

8-Channel DMA Offloading: The TMS320VC5510AZGWA2 automates data streaming between McBSPs, HPI, and memory, freeing the CPU to focus entirely on algorithm execution.

Excellent Power Efficiency: The TMS320VC5510AZGWA2’s C55x core delivers high processing power with very low mW/MIPS, ideal for thermally constrained or battery-operated designs.

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FAQ

1. What do the “A” and “2” suffixes mean? What is the temperature range?
   
   • “A” denotes the silicon revision (TMS320VC5510A), and “2” indicates the 200MHz speed grade. The TMS320VC5510AZGWA2 is rated for the industrial temperature range of -40°C to +85°C.
2. How does the TMS320VC5510AZGWA2 differ from the TMS320VC5509A?
   
   • The TMS320VC5510AZGWA2 lacks USB and MMC/SD but offers a larger DARAM (128KB) and a 176-ball BGA package, focusing on industrial and communication applications needing multiple McBSPs and an HPI.
3. What algorithms can the 256KB SRAM of the TMS320VC5510AZGWA2 support?
   
   • The zero-wait-state SRAM of the TMS320VC5510AZGWA2 easily holds high-order FIR/IIR filter banks, multi-channel FFTs, adaptive algorithms, and full speech/audio codecs, with ample room for data buffering.
4. What can the three McBSPs of the TMS320VC5510AZGWA2 connect to?
   
   • Each McBSP on the TMS320VC5510AZGWA2 supports I2S, TDM, and other serial protocols, enabling simultaneous connection to multiple stereo audio codecs, multi-channel ADCs/DACs, or digital communication front-ends.
5. What is the HPI interface of the TMS320VC5510AZGWA2 used for?
   
   • The 16-bit HPI on the TMS320VC5510AZGWA2 allows an external host (ARM, MCU) to directly access DSP internal RAM, facilitating master-slave architectures with dedicated signal processing offload.
6. What development tools are needed for the TMS320VC5510AZGWA2?
   
   • For the TMS320VC5510AZGWA2, TI's free Code Composer Studio (CCS) with C55x DSPLIB is recommended. Debug using XDS100 or XDS200 JTAG emulators.
7. How is the power consumption of the TMS320VC5510AZGWA2? Is it suitable for battery operation?
   
   • The C55x architecture of the TMS320VC5510AZGWA2 is renowned for excellent energy efficiency, with low power at 200MHz and multiple idle modes, perfect for battery-powered or thermally sensitive designs.
8. What benefit does the 8-channel DMA of the TMS320VC5510AZGWA2 provide?
   
   • The DMA in the TMS320VC5510AZGWA2 automates data movement between McBSPs, HPI, and memory, offloading the CPU so it can focus entirely on algorithms, greatly improving real-time throughput.
9. Is the 176-ball MicroStar BGA package of the TMS320VC5510AZGWA2 difficult to design with?
   
   • With 0.8mm ball pitch, the TMS320VC5510AZGWA2’s BGA is a medium-density BGA; standard reflow yields high quality, and PCB routing is manageable for most multi-layer boards.
10. What are the upgrade options for higher performance than the TMS320VC5510AZGWA2?
    
    • To upgrade from the TMS320VC5510AZGWA2, consider TI's TMS320C5517 or C674x family (e.g., C6748), which offer higher clock speeds, larger memory, and richer peripherals while maintaining low power or adding floating-point capability.