STM32H750IBK6 ST Mainstream Arm Cortex-M7 High-Performance 32-bit MCU 128KB Flash 1MB SRAM LCD-TFT Chrom-ART CAN FD USB OTG Ethernet Crypto UFBGA-176+25

STM32H750IBK6 Product Overview

STM32H750IBK6 is a Cortex-M7 MCU at 480 MHz with double-precision FPU, UFBGA-176+25. 128 KB Flash, 1 MB SRAM, LCD-TFT controller (up to XGA), Chrom-ART accelerator (DMA2D), Ethernet MAC, USB OTG HS/FS (HS requires external ULPI PHY), CAN FD, HW crypto (AES/CRYP/HASH/RNG), dual Quad SPI, FMC (SDRAM), three 16-bit ADCs (5 Msps, 24 ch), two 12-bit DACs, two comparators, two op-amps, advanced motor control timers, GP/LP timers, RTC, 8×USART/UART, 5×SPI/I2S, 4×I2C, SDIO, SAI, SPDIF-Rx. Up to 168 x 5 V-tolerant I/Os. 1.62–3.6 V, -40–85 °C. Compared to the H743 series, retains the full 1 MB SRAM and hardware graphics acceleration while offering a streamlined 128 KB Flash, delivering a highly cost-effective solution for high-end embedded graphics, real-time control, and industrial networking applications that execute code from external memory.

STM32H750IBK6 Core Features

Core: Cortex-M7 480 MHz, DPFPU + L1 cache (16 KB I-cache + 16 KB D-cache)

Memory: 128 KB Flash, 1 MB SRAM (incl. large DTCM and ITCM)

Graphics & Display: LCD-TFT controller (up to XGA), Chrom-ART accelerator (DMA2D)

Connectivity: Ethernet MAC, USB OTG HS/FS (HS needs external ULPI PHY), CAN FD, SDIO, SAI, SPDIF-Rx, 8×USART/UART, 5×SPI/I2S, 4×I2C

Security: Hardware AES/CRYP/HASH/RNG crypto coprocessor

Analog: 3×16-bit ADCs (5 Msps, 24 ch), 2×12-bit DACs, 2×Comparators, 2×Op-Amps

Motor Control: 2×Advanced Timers (PWM/Deadtime/Brake), multiple GP/LP timers

Memory Expansion: FMC (SDRAM/PSRAM/NOR/NAND), Dual Quad SPI

I/Os: 168 (5 V-tolerant)

Package: UFBGA-176+25

Temperature Range: -40°C to 85°C

STM32H750IBK6 Applications

Advanced HMI: Industrial touchscreens, graphical dashboards, smart home control panels

Real-Time Control & Networking: High-end PLCs, servo drives, industrial Ethernet gateways

Security Systems: Secure communication nodes, data encryption terminals

Multimedia Processing: Digital audio equipment, graphical display terminals

Space-Constrained Devices: High-performance handhelds, portable medical instruments requiring rich I/O and graphics

STM32H750IBK6 Key Advantages

480 MHz Cortex-M7 + DPFPU: Ultimate real-time processing and floating-point performance

1 MB SRAM + Chrom-ART Acceleration: Massive buffer for smooth high-resolution display driving

Ethernet + CAN FD + HW Crypto: Single-chip for industrial networking, real-time communication, and data security

168 I/Os in Ultra-Compact UFBGA-176+25 Package: Extremely high-density integration, saving PCB space

Cost-Effective Graphics & Control Solution: Retains powerful H7 graphics and compute core, reduces overall cost when paired with external Flash

Dual Quad SPI + FMC: Flexible external code/data memory expansion

1.62–3.6 V Wide Supply: Adaptable to various power scenarios

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FAQ

1. What is the STM32H750IBK6 and what is its standout feature?
The STM32H750IBK6 is a high‑performance MCU from STMicroelectronics' STM32H7 series, built around an Arm® Cortex®‑M7 core running at up to 480 MHz in a UFBGA‑176 package (0.65 mm pitch). It carries the same 128 KB on‑chip Flash and 1 MB SRAM as other H750 variants. Its standout feature is the dense 176‑pin BGA package, which provides up to 140 usable I/Os, allowing nearly all peripheral functions to be brought out without increasing board area—ideal for space‑constrained yet interface‑rich embedded systems.

2. What are the advantages of the UFBGA‑176 package? How does it compare with LQFP‑100 or BGA‑240?
The UFBGA‑176 packs 140 I/Os into a compact 10 mm × 10 mm footprint, offering nearly double the available pins of an LQFP‑100 while saving PCB area and routing layers compared to a larger BGA‑240. Its 0.65 mm ball pitch is moderate for PCB fabrication, and a 4‑layer or 6‑layer board can usually fully break out all pins. This package achieves an excellent balance of performance and integration for applications that need numerous peripherals—such as dual Ethernet, multiple CAN FD channels, an LCD controller, and SDRAM—but have limited enclosure space.

3. With only 128 KB of on‑chip Flash, how are large applications executed, and is performance compromised?
As with all H750‑series devices, the 128 KB on‑chip Flash is primarily used for boot and secure loader functions. The main application, graphics assets, and file systems reside in external Quad SPI Flash, which can be memory‑mapped so the CPU can fetch instructions directly. Combined with the 1 MB multi‑bank SRAM acting as a cache, sequential read throughput is very high, and real‑world execution speed closely approaches that of on‑chip Flash—easily supporting complex HMIs, real‑time control, and signal processing tasks.

4. How is the 1 MB on‑chip SRAM organized, and what benefits does the multi‑bank architecture offer for high‑speed data flows?
The 1 MB SRAM is split into DTCM, ITCM, AXI SRAM, and multiple AHB SRAM blocks. DTCM and ITCM provide zero‑wait‑state CPU access for deterministic real‑time response. The multi‑bank design allows DMA and the CPU to access different memory regions simultaneously without blocking—critical when simultaneously handling Ethernet traffic, LCD refresh, high‑speed ADC acquisition, and motor control, effectively avoiding bus contention and improving overall throughput.

5. Is the Chrom‑ART accelerator and TFT‑LCD controller fully available on the IBK6? What display size can it drive?
Yes, both are fully functional. The built‑in Chrom‑ART (DMA2D) hardware accelerator handles 2D graphics operations such as fills, copies, blending, and format conversion. Together with the on‑chip TFT‑LCD controller, it can directly drive a 24‑bit RGB display at resolutions up to 1024×768, running complex user interfaces smoothly. Chrom‑ART offloads graphics processing to the background, freeing the Cortex‑M7 to focus on real‑time control—making it an ideal core for industrial HMIs, smart‑home panels, and test‑and‑measurement equipment.

6. What external memory types can be connected via FMC and dual QSPI? Can SDRAM and NOR Flash coexist?
Yes. The Flexible Memory Controller (FMC) supports standard SDRAM, enabling tens of megabytes of runtime memory expansion, and can also interface with parallel NOR/NAND Flash. The dual Quad SPI interfaces can connect high‑speed NOR Flash or HyperRAM. These interfaces do not conflict, allowing you to build a system with external SDRAM for data buffering, QSPI Flash for code and graphics storage, and parallel NOR Flash for redundant firmware—creating a highly flexible memory architecture.

7. Does the chip provide multiple Ethernet, USB HS, and CAN FD interfaces? Can they all be brought out in the 176‑pin package?
The chip integrates one 10/100M Ethernet MAC (with IEEE 1588), one USB 2.0 OTG high‑speed controller (480 Mbps), and up to three FDCAN controllers. Thanks to the abundant I/Os of the UFBGA‑176 package, you can simultaneously bring out the Ethernet RMII interface, the USB HS ULPI interface, and all required signals for multiple CAN FD transceivers without significant pin conflicts. This is especially valuable for industrial gateways and vehicle network controllers that require multi‑protocol real‑time communication.

8. Does the chip have a hardware crypto module? How can firmware and communication security be ensured?
The STM32H750IBK6 does not include a dedicated CRYP hardware accelerator, but it does provide a hardware true‑random‑number generator (TRNG), a Memory Protection Unit (MPU), and code readout protection (RDP). Encryption algorithms such as AES and SHA can be efficiently implemented in software using the Cortex‑M7’s DSP instructions and optimized libraries. For most IoT and industrial communication applications, software encryption combined with TRNG offers adequate security. If hardware‑accelerated cryptography and hashing are required, pin‑compatible models with a CRYP module are available.

9. What about power consumption and thermal management? Any recommendations for the BGA package's thermal pad design?
The H750IBK6 is built on a 40 nm low‑power process and typically consumes around 1 W at 480 MHz full load. The UFBGA‑176 package does not have an exposed thermal pad; heat is primarily conducted through internal GND balls and the PCB’s ground planes. It is recommended to use as much continuous copper for ground planes on all PCB layers beneath the chip as possible, and to connect them with multiple thermal vias to enhance heat dissipation. Within the commercial temperature range (0 °C–85 °C), proper PCB thermal design ensures stable long‑term operation.

10. If I later need more on‑chip Flash or hardware crypto, what upgrade options are available?
If the 128 KB on‑chip Flash is insufficient or hardware‑accelerated cryptography and hashing are required, you can directly upgrade to the pin‑compatible STM32H753IIK6 (or another UFBGA‑176 variant in the H753 family). The H753 provides up to 2 MB of on‑chip Flash and a complete CRYP hardware accelerator, while retaining the same 1 MB SRAM and all high‑performance peripherals. Because the pinout is fully compatible, upgrading requires no PCB design changes and code migration is straightforward.