STM32H723ZET6 ST Mainstream Arm Cortex-M7 High-Performance 32-bit MCU 512KB Flash 564KB SRAM CAN FD USB OTG Ethernet LQFP-144

STM32H723ZET6 Product Overview

STM32H723ZET6 is a Cortex-M7 MCU at 550 MHz with double-precision FPU, LQFP-144. 512 KB dual-bank Flash, 564 KB SRAM, USB OTG HS/FS (on-chip HS PHY), Ethernet MAC, CAN FD, dual Quad SPI, FMC (SDRAM), three 16-bit ADCs (5 Msps, 24 ch), two 12-bit DACs, two comparators, two op-amps, advanced motor control timers, GP/LP timers, RTC, 8×USART/UART, 5×SPI/I2S, 4×I2C, SDIO, SAI, SPDIF-Rx. 114 x 5 V-tolerant I/Os. 1.71–3.6 V, -40–85 °C. Compared to the 100-pin H723VET6, offers more I/Os and ADC channels, making it ideal for high-performance real-time control and industrial networking applications requiring extensive pin connectivity.

STM32H723ZET6 Core Features

Core: Cortex-M7 550 MHz, DPFPU + L1 cache (16 KB I-cache + 16 KB D-cache)

Memory: 512 KB Dual-Bank Flash, 564 KB SRAM (incl. 128 KB DTCM)

Connectivity: Ethernet MAC, USB OTG HS/FS (on-chip HS PHY), CAN FD, SDIO, SAI, SPDIF-Rx, 8×USART/UART, 5×SPI/I2S, 4×I2C

Analog: 3×16-bit ADCs (5 Msps, 24 ch), 2×12-bit DACs, 2×Comparators, 2×Op-Amps

Motor Control: 2×Advanced Timers (PWM/Deadtime/Brake), multiple GP/LP timers

Memory Expansion: FMC (SDRAM/PSRAM/NOR/NAND), Dual Quad SPI

I/Os: 114 (5 V-tolerant)

Package: LQFP-144

Temperature Range: -40°C to 85°C

STM32H723ZET6 Applications

Industrial Control: Real-time controllers, PLCs, servo drives, industrial Ethernet gateways

High-Speed Communication: Ethernet/CAN FD/USB HS interface conversion and bridging

Audio & Consumer: Digital audio equipment, advanced consumer electronics

Motor Control: High-precision FOC, multi-axis servo control

Portable Medical & Instrumentation: High-performance handheld devices, precision data acquisition

STM32H723ZET6 Key Advantages

550 MHz Cortex-M7 + DPFPU: Ultimate real-time processing and floating-point performance

114 I/Os + 24 ADC Channels: Rich pin and analog acquisition resources for complex system integration

On-Chip USB HS PHY: Eliminates external HS PHY, simplifying design and BOM

Ethernet + CAN FD + Rich Connectivity: Single-chip for industrial networking and real-time communication

Dual-Bank Flash + 564 KB SRAM: Safe firmware updates and complex data processing

Dual Quad SPI + FMC: Flexible external memory expansion

1.71–3.6 V Wide Supply: Adaptable to various power scenarios

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FAQ

1. How does the STM32H723ZET6 differ from the STM32H723ZGT6, and how should I choose based on Flash size?
Both share the same Cortex‑M7 core (550 MHz), SRAM (564 KB), peripherals, and LQFP‑144 package. The only difference is on‑chip Flash capacity: ZET6 has 512 KB, while ZGT6 has 1 MB. If your firmware, graphics assets, and critical data fit within 512 KB, the ZET6 delivers identical performance and security features at a lower cost. If you need more program space or plan for future expansion, the ZGT6 provides twice the storage headroom. Both support external Flash via dual QSPI, so even with the ZET6 you can offload large graphics and file systems to external memory.

2. With only 512 KB of on‑chip Flash, can it run large applications? How do I expand storage?
512 KB of Flash is sufficient for most real‑time operating systems (e.g., FreeRTOS), a full TCP/IP stack, file systems, and complex control algorithms. For applications requiring large graphical interfaces or file storage, you can use the dual Quad SPI interfaces to connect low‑cost external NOR Flash or HyperRAM, which support memory‑mapped mode for direct code execution or asset loading. Additionally, the H723’s 564 KB SRAM provides ample runtime memory, so the 512 KB on‑chip Flash rarely becomes a performance bottleneck.

3. What advantages does the 550 MHz Cortex‑M7 on the STM32H723ZET6 offer over the 480 MHz STM32H743?
The 550 MHz Cortex‑M7 delivers approximately 1178 DMIPS and 2778 CoreMark—a roughly 15% performance uplift over the 480 MHz H743. With the same double‑precision FPU, DSP extensions, 512 KB dual‑bank Flash, 564 KB SRAM, and a complete hardware crypto accelerator in an LQFP‑144 package, it is particularly well‑suited for industrial control, motor drives, and communication gateways that demand rigorous real‑time computation, data security, and cost efficiency.

4. How is the 564 KB SRAM organized, and how does it benefit hard real‑time tasks?
The SRAM is carefully partitioned into 128 KB DTCM (Data Tightly Coupled Memory), 64 KB ITCM (Instruction Tightly Coupled Memory), 256 KB AXI SRAM, and 128 KB low‑power SRAM (retainable in Stop mode). DTCM and ITCM provide zero‑wait‑state CPU access for the lowest and most deterministic interrupt and control‑loop latency. The multi‑bank architecture allows DMA and the CPU to access different regions simultaneously without blocking, significantly boosting throughput when concurrently handling Ethernet, LCD refresh, and high‑speed ADC acquisition.

5. Does the 512 KB Flash support dual‑bank and OTA updates? How can update safety be ensured?
Yes. Despite the 512 KB capacity, it still supports a dual‑bank architecture, allowing code execution from one bank while the other is being erased and programmed. Once a new firmware image is downloaded to the alternate bank and verified, a simple boot‑address switch completes the update. If a power loss or verification failure occurs, the system automatically rolls back to the original firmware, guaranteeing the device is never bricked. Combined with the on‑chip AES‑256 and SHA accelerators, fully secure firmware updates can be implemented—ideal for industrial IoT gateways and critical infrastructure requiring highly reliable remote maintenance.

6. Are the Chrom‑ART accelerator and LCD controller fully featured on the H723ZET6? What display size can be driven?
Fully integrated. The Chrom‑ART (DMA2D) hardware accelerator handles 2D graphics operations without consuming extra I/Os. The on‑chip TFT‑LCD controller (LTDC) can bring out a complete 24‑bit RGB interface within the 114 I/Os of the LQFP‑144 package, directly driving displays up to 1024×768 resolution and smoothly running graphics libraries like TouchGFX. Compared to packages with fewer I/Os, the H723 offers more relaxed pin allocation between the display and other peripherals.

7. What hardware security features does the chip integrate? Is secure boot supported?
It includes a hardware true‑random‑number generator (TRNG), an AES‑256 encryption accelerator, and SHA‑1/SHA‑2 and HMAC hashing accelerators for efficient encryption and authentication. Together with the dual‑bank Flash and code readout protection (RDP), it can establish a complete chain of trust from secure boot to encrypted firmware updates, effectively preventing unauthorized firmware access or tampering. This is especially important in payment terminals, IoT security gateways, and industrial controllers where IP protection is essential.

8. What external memory types can be connected via FMC and dual QSPI? Is SDRAM supported?
The Flexible Memory Controller (FMC) supports standard 16/32‑bit SDRAM, allowing up to 256 MB of runtime memory expansion, and can also interface with parallel NOR/NAND Flash. The dual Quad SPI interfaces support memory‑mapped mode and can connect high‑speed NOR Flash (up to 512 Mbit) or HyperRAM for code, graphics, and file storage. These interfaces do not conflict; within the LQFP‑144 package, you can simultaneously use a 32‑bit SDRAM bus and both QSPI ports to build a highly flexible memory architecture.

9. How should power and thermal management be handled at 550 MHz full load? Is the LQFP‑144 package reliable?
Typical power consumption at full load is around 1–1.5 W. The LQFP‑144 package has no exposed thermal pad, but effective heat dissipation can be achieved through a large ground copper pour under the chip, a multi‑layer PCB, and sufficient thermal vias—no external heatsink is required. The chip supports dynamic frequency scaling and multiple low‑power modes (Sleep, Stop, Standby) to significantly reduce power during idle periods. It is usually rated for the industrial temperature range (-40 °C to 85 °C), and with good thermal design, reliable long‑term operation can be ensured.

10. Is the software toolchain for the STM32H723ZET6 mature? Can I reuse code from previous STM32F4/F7 projects?
Very mature. It is fully compatible with the STM32Cube ecosystem, including the free STM32CubeMX graphical configuration tool, STM32CubeIDE integrated development environment, and the feature‑rich STM32CubeH7 firmware package. When migrating from STM32F4 or F7, a large portion of HAL code can be reused, with the main adjustments being peripheral configuration and memory mapping. ST also provides extensive example projects and middleware covering Ethernet, USB, graphics, and file systems to jump‑start development.