STM32G473RET6 ST Mainstream Arm Cortex-M4 Mixed-Signal 32-bit MCU 512KB Flash 128KB SRAM Σ-Δ OpAmp DAC Comparator CAN FD USB LQFP-64

STM32G473RET6 Product Overview

STM32G473RET6 is a Cortex-M4 MCU at 170 MHz with FPU and math accelerator, LQFP-64. 512 KB Flash, 128 KB SRAM, USB 2.0 FS device (crystal-less), CAN FD, two 12-bit ADCs (5 Msps, 21 ch), two 12-bit DACs, four op-amps (PGA), three comparators, four Σ-Δ modulators (DFSDM), advanced motor control PWM, LP timers, RTC, 3×USART/UART, 2×SPI/I2S, 2×I2C. 52 x 5 V-tolerant I/Os. 1.7–3.6 V, -40–85 °C. Compared to G473RCT6 (256 KB Flash), doubles Flash to 512 KB, providing ample storage for large code and complex algorithms — the top-tier 64-pin model in the G473 series.

STM32G473RET6 Core Features

Core: Cortex-M4 170 MHz, FPU + ART Accelerator + Math Accelerator (FMAC, CORDIC)

Memory: 512 KB Flash, 128 KB SRAM

Analog: 4×PGAs, 2×12-bit ADCs (5 Msps, 21 ch), 2×12-bit DACs, 3×Comparators

Σ-Δ Modulators: 4×Σ-Δ modulators with DFSDM for high-precision sensor interfaces

Motor Control: 2×Advanced Timers (PWM/Deadtime/Brake), multiple GP/LP timers

Connectivity: USB 2.0 FS (Crystal-less), CAN FD, 3×USART/UART, 2×SPI/I2S, 2×I2C

I/Os: 52 (5 V-tolerant)

Package: LQFP-64

STM32G473RET6 Applications

Digital Power: SMPS, Inverters, PFC

Motor Control: FOC, BLDC/PMSM Drives, Servo Controllers

Precision Sensing: High-accuracy Σ-Δ sensor measurement, industrial transmitters

Instrumentation: High-Precision Data Acquisition & Signal Conditioning

Consumer Electronics: Drones, Power Tools, Portable Medical

Automotive/Industrial: CAN FD Nodes, Industrial Automation

STM32G473RET6 Key Advantages

512 KB Flash + 128 KB SRAM: Massive storage for complex control algorithms and protocol stacks

4×Σ-Δ Modulators + 4×Op-Amps + 3×Comparators + ADC/DAC: Top-tier analog integration for precision measurement and control

170 MHz Cortex-M4 + FPU + Math Accelerator: Blazing-fast DSP and control

USB 2.0 + CAN FD: High-speed USB and industrial CAN bus on one chip

52 I/Os in 64-Pin Package: Rich pin resources for complex system integration

1.7–3.6 V Wide Supply: Flexible for battery and various power sources

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FAQ

1. What is the STM32G473RET6, and where is it positioned in the STM32G4 series?
The STM32G473RET6 is a high‑performance mixed‑signal microcontroller from STMicroelectronics' STM32G4 series, built around an Arm® Cortex®‑M4 core with FPU and DSP extensions running at up to 170 MHz, in an LQFP‑64 package. It is a well‑balanced member of the G473 family, providing 512 KB dual‑bank Flash and 128 KB SRAM, while retaining four rail‑to‑rail op‑amps, four ultra‑low‑power comparators, and a rich set of digital peripherals. Compared to the G474 series, it omits the high‑resolution timer (HRTIM) to focus on cost‑effective applications that do not require extremely high PWM resolution but still demand excellent analog performance and real‑time control, such as general‑purpose servo drives, industrial sensors, power‑tool controllers, and compact digital power systems.

2. How does the STM32G473RET6 differ from the STM32G474RET6? Which one should I choose?
Both share the same Cortex‑M4 170 MHz core, 512 KB dual‑bank Flash, 128 KB SRAM, and LQFP‑64 package. However, the G473 simplifies some analog peripherals: the G474 offers five op‑amps, seven comparators, and the high‑resolution timer (HRTIM), while the G473 typically provides four op‑amps, four comparators, and no HRTIM. If your application does not involve complex power topologies requiring 184‑ps‑class PWM resolution (such as LLC resonant converters or phase‑shifted full‑bridges) and has moderate analog‑channel needs, the G473 delivers the same processing performance and communication interfaces at a more competitive cost, making it ideal for cost‑sensitive, high‑volume products with solid feature requirements.

3. Does the 512 KB dual‑bank Flash support OTA updates? How can update safety be ensured?
Fully supported. The dual‑bank architecture allows current firmware to execute from one bank while the other is erased and programmed. After a new firmware image is downloaded to the alternate bank and verified, a simple boot‑address switch completes the update. If a power loss or verification failure occurs, the system automatically rolls back to the original firmware, guaranteeing the device is never bricked. Combined with code readout protection (RDP) and the Memory Protection Unit (MPU), a secure remote firmware‑update mechanism can be implemented—ideal for industrial equipment deployed in remote locations that require highly reliable remote maintenance.

4. What can the built‑in op‑amps and comparators actually do? Can they eliminate external analog chips?
The chip integrates four rail‑to‑rail operational amplifiers and four ultra‑low‑power comparators. The op‑amps can directly process small signals from current‑sense resistors, Hall sensors, or thermocouples, performing amplification, filtering, and offset adjustment—completely eliminating external op‑amp ICs. The comparators are used for over‑current protection, zero‑crossing detection, and voltage‑threshold monitoring. All these analog blocks are tightly coupled internally with ADCs and timers to form complete digital control loops, significantly reducing BOM cost and PCB area, especially for space‑constrained compact control boards.

5. What high‑speed communication interfaces does the chip offer? Does it support CAN FD?
It integrates up to three FDCAN (Flexible Data‑Rate CAN) controllers, which are backward‑compatible with CAN 2.0 while supporting data rates up to 5 Mbps and payloads up to 64 bytes. Additionally, it provides multiple UARTs, SPIs, I²Cs, and I²S interfaces. All of these can operate simultaneously, making the chip ideal for industrial automation, vehicle networks, and distributed control systems that require high‑speed, reliable communication. Within the LQFP‑64 package, careful pin‑multiplexing allows multiple CAN FD and UART/SPI channels to be brought out concurrently, meeting most field‑communication needs.

6. What can the USB‑C interface on the STM32G473RET6 do? Does it support Power Delivery?
The integrated USB‑C power‑delivery and communication controller supports USB 2.0 full‑speed device communication and can deliver up to 15 W (5 V/3 A) through simple CC‑pin detection. It does not implement the full USB Power Delivery (PD) protocol. If a complete PD stack is required, an external dedicated PD controller can be added. For applications that do not need PD, the MCU can be powered and communicate directly over USB‑C, making it ideal for portable devices and small USB‑powered instruments.

7. Is the LQFP‑64 package easy to solder? Is it suitable for low‑volume hand assembly?
Very easy. The LQFP‑64 has all pins exposed with a 0.5 mm pitch and can be drag‑soldered with a standard iron and flux—no hot‑air station required. It strikes an excellent balance between mass production and hand prototyping, making it ideal for hobbyists, students, and small teams for rapid development and low‑volume production. The 10 mm × 10 mm size offers great compactness while remaining highly manageable, and it provides up to 51 usable I/Os to meet the needs of most industrial control and IoT applications.

8. What is its power consumption like? Is it suitable for industrial wide‑temperature environments?
The STM32G4 series is built on an advanced 90 nm process, with a run‑mode current as low as about 100 µA/MHz. It supports multiple low‑power modes—Sleep, Stop, and Standby—with Standby current dropping to the micro‑amp range. Combined with fast wake‑up times, it is well‑suited for battery‑powered portable industrial equipment and handheld instruments that require long battery life. The chip is typically rated for the industrial temperature range (-40 °C to 85 °C) and can operate reliably over the long term in harsh industrial environments.

9. What development tools are needed for the STM32G473RET6, and is it compatible with previous STM32 ecosystems?
It is fully compatible with the STM32Cube ecosystem, including the free STM32CubeMX configuration tool, STM32CubeIDE integrated development environment, and the STM32CubeG4 firmware package. If you have previously worked with STM32F3 or STM32F4 series, a large portion of HAL code can be reused; the main adjustments involve analog‑peripheral configuration and pin mapping. Official example projects and reference designs for motor control and digital power are also provided to accelerate development.

10. If I later need HRTIM or more analog peripherals, what upgrade options are available?
If your project later requires high‑resolution PWM (e.g., for LLC or phase‑shifted full‑bridge) or more op‑amps/comparators, you can directly upgrade to the pin‑compatible STM32G474RET6. It provides the full HRTIM, along with five op‑amps and seven comparators, while retaining the same Flash and SRAM capacities, with zero hardware changes. If you need greater computational power and larger SRAM, you can move to the STM32H7 series (such as the STM32H723 or H743). Because all these devices belong to the same STM32 ecosystem, code and hardware designs can be highly reused, and migration effort is minimal.