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SCY E64GCH9T1ABE00 64GB eMMC Embedded Flash Storage Chip BGA153
E64GCH9T1ABE00 Product Overview
The SCY E64GCH9T1ABE00 is a 64GB eMMC flash storage chip, independently developed and manufactured by SCY, a well-known domestic storage chip company. The E64GCH9T1ABE00 complies with JEDEC eMMC 5.0/5.1 standards, featuring a BGA153 package that highly integrates the MMC interface, flash memory device, and main controller. The E64GCH9T1ABE00 adopts SMI's latest LDPC ECC error correction engine-based controller chip, paired with YMTC Xtacking architecture 3rd Gen TLC 3D NAND flash memory. Since SCY began mass production of eMMC in 2019, the E64GCH9T1ABE00 has been widely used in smartphones, tablets, smart TV boxes, set-top boxes, automotive electronics, video surveillance, industrial control, and other embedded intelligent terminal devices.
E64GCH9T1ABE00 Key Features
Large Storage Capacity: The E64GCH9T1ABE00 provides 64GB storage capacity to meet the demands of operating systems, applications, and user data.
eMMC 5.0/5.1 Standard: The E64GCH9T1ABE00 complies with JEDEC eMMC 5.0/5.1 standards, delivering fast and upgradeable performance.
BGA153 Package: The E64GCH9T1ABE00 features a BGA153 standard package that integrates the MMC interface, flash memory device, and main controller into one.
Dual-Voltage Operation: The E64GCH9T1ABE00 supports both 1.8V and 3.3V interface voltages to accommodate different platform design requirements.
LDPC ECC Engine: The E64GCH9T1ABE00 features SMI's latest LDPC ECC error correction engine-based controller chip, effectively reducing uncorrectable bit error rate (UBER).
YMTC 3D NAND Flash: The E64GCH9T1ABE00 is paired with YMTC Xtacking architecture 3rd Gen TLC 3D NAND flash memory, offering high density, high speed, and high reliability.
Low Host Processor Load: The E64GCH9T1ABE00 significantly reduces storage management load on the host processor, freeing CPU resources for core applications.
Domestically Developed: SCY possesses integrated capabilities in chip design, firmware development, packaging, testing, manufacturing, and application of the E64GCH9T1ABE00.
E64GCH9T1ABE00 Applications
The E64GCH9T1ABE00 is widely used in the following fields:
Smartphones and Tablets: The E64GCH9T1ABE00 serves as the main storage chip for mobile terminals
Smart TVs and Set-Top Boxes: The E64GCH9T1ABE00 provides system storage for home entertainment devices
Networking Products: The E64GCH9T1ABE00 is used in routers, gateways, and other network communication devices
Video Surveillance: The E64GCH9T1ABE00 enables data storage for security monitoring systems
Automotive Electronics: The E64GCH9T1ABE00 is suitable for in-vehicle infotainment systems, instrument clusters
Industrial Control: The E64GCH9T1ABE00 is used in embedded industrial control systems
Smart Wearables: The E64GCH9T1ABE00 is designed into smart watches, bands, and other wearable devices
Consumer Electronics: The E64GCH9T1ABE00 is found in e-book readers, digital cameras, voice recorders, MP3/MP4 players, etc.
E64GCH9T1ABE00 Key Advantages
Large Storage Capacity: The E64GCH9T1ABE00's 64GB capacity meets the storage demands of mainstream smart devices, easily accommodating operating systems, various applications, and user data.
BGA153 Standard Package: The E64GCH9T1ABE00 comes in an industry-standard BGA153 package ensuring perfect compatibility with mainstream platforms for easy direct replacement and upgrades.
LDPC ECC Engine: The E64GCH9T1ABE00 integrates SMI's latest LDPC ECC error correction engine-based controller chip significantly improving data integrity and storage lifespan.
YMTC 3D NAND Flash: The E64GCH9T1ABE00 is paired with YMTC Xtacking architecture 3rd Gen TLC 3D NAND flash memory, reducing storage costs while improving performance.
Dual-Voltage Flexibility: The E64GCH9T1ABE00 supports both 1.8V and 3.3V interface voltages for flexible adaptation to different platform designs.
Full Industry Chain Self-Sufficiency: SCY is a national high-tech enterprise and a national-level "Specialized and Sophisticated" Little Giant enterprise, with full industry chain capabilities from chip design and packaging to module manufacturing of the E64GCH9T1ABE00.
High-Yield Quality Assurance: SCY achieves an ultra-high 99.98% yield rate in BGA package encapsulation of the E64GCH9T1ABE00 using YMTC wafers.
One-Stop Storage Solutions: Products like the E64GCH9T1ABE00 cover three major application scenarios: smartphones, PCs, and servers, providing global customers with one-stop storage solutions and customized services.
Mature Mass Production Experience: Since SCY began mass production of eMMC in 2019, monthly production has exceeded 3KK pcs, with products covering the full capacity range from 8GB to 256GB, including the E64GCH9T1ABE00.
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FAQ
1. What is E64GCH9T1ABE00?
The E64GCH9T1ABE00 is an eMMC (embedded MultiMediaCard) storage chip from SCY (Shichuangyi). It integrates NAND flash and a controller into a single BGA package, providing a standardized storage solution for embedded systems.
2. What are the key specifications?
Key specifications of the E64GCH9T1ABE00 are as follows:
Storage Capacity: 64GB
Flash Interface: eMMC 5.1
Operating Voltage: VCC=3.3V, VCCQ=1.8V or 3.3V
Package: BGA-153 (11.5mm × 13.0mm)
3. What package does it use?
The E64GCH9T1ABE00 uses a BGA-153 (Ball Grid Array) package. This is a 153-ball FBGA package, typically measuring 11.5mm × 13.0mm.
4. What applications is it suitable for?
The E64GCH9T1ABE00 is widely used in various embedded devices, including:
Smartphones and Tablets
Set-top boxes and Smart TVs
Industrial control and IoT devices
Automotive infotainment systems
Security surveillance and Wearable devices
5. What development tools support it?
As a standard eMMC storage chip, the E64GCH9T1ABE00 requires no dedicated software tools. Host platforms have built-in eMMC controller drivers, and the system can directly recognize and manage it.
6. What is the operating temperature range?
SCY eMMC products like the E64GCH9T1ABE00 are typically available in different temperature grades:
Consumer Grade: -25°C to +85°C
Industrial Grade: -40°C to +85°C
7. What are the key features?
High Integration: The E64GCH9T1ABE00 combines flash memory and controller in a single chip, simplifying system design
Standardized Interface: The E64GCH9T1ABE00 complies with JEDEC eMMC 5.1 standards for strong compatibility
Supports Large Capacities: SCY eMMC covers capacities from 8GB to 256GB, with the E64GCH9T1ABE00 offering 64GB
Low Power Design: The E64GCH9T1ABE00 supports interface voltage of 1.8V or 3.3V
Data Protection: The E64GCH9T1ABE00 supports LDPC ECC, wear leveling, etc.
8. What interfaces does it support?
Host Interface: The E64GCH9T1ABE00 complies with the eMMC 5.1 standard protocol
The E64GCH9T1ABE00 supports HS400 high-speed mode, with interface speeds up to 400MB/s
Package: 153-ball BGA
9. What are the alternative models?
SCY same-series 64GB eMMC models: E64GCYNT1ABE00
SCY same-series model: E64GCYNE1ABE00
Other brand compatible models: SDINBDG4-8G-XAT2
10. What are the design considerations?
Pin Compatibility: For the E64GCH9T1ABE00, BGA package pin definitions should be confirmed with the official datasheet
PCB Layout: High-speed signal traces require impedance matching and length control
Power Decoupling: Proper decoupling capacitors should be placed near VCC and VCCQ pins of the E64GCH9T1ABE00
Voltage Selection: The E64GCH9T1ABE00 supports VCCQ at both 1.8V and 3.3V
Temperature Grade Confirmation: Select consumer or industrial grade based on the application environment for the E64GCH9T1ABE00
- Model:
- E64GCH9T1ABE00
- Brand:
- SCY
- Memory Type:
- eMMC
- Storage Capacity:
- 64GB
- Protocol Standard:
- eMMC
- Operating Voltage:
- 1.8V / 3.3V
- Product Type:
- Embedded Storage Chip
- Package:
- BGA
- Application:
- smartphones, tablets, and set-top boxes
