SanDisk SDINBDA6-64G-XI1 64GB eMMC 5.1 Embedded Flash Storage iNAND IX EM132 Industrial Grade BGA153 Package

SDINBDA6-64G-XI1 Product Overview

The SDINBDA6-64G-XI1 is a 64GB eMMC 5.1 embedded flash storage chip from SanDisk brand, part of the iNAND® IX EM132 series industrial-grade Embedded Flash Drives (EFDs) . Housed in a TFBGA-153 package with 3D TLC NAND flash technology, SDINBDA6-64G-XI1 supports the eMMC 5.1 HS400 high-speed interface, delivering sequential read speeds up to 310MB/s and sequential write speeds up to 150MB/s. Operating from 2.7V to 3.6V with an industrial temperature range of -40℃ to +85℃, SDINBDA6-64G-XI1 meets demanding industrial application requirements. SDINBDA6-64G-XI1 features SmartSLC cache technology, enhanced Power Immunity, ECC, Wear Leveling, and Bad Block Management. SDINBDA6-64G-XI1 is widely used in industrial control, medical devices, outdoor IoT, communication equipment, and smart metering applications requiring high reliability and endurance.

SDINBDA6-64G-XI1 Key Features

64GB Large Storage Capacity: SDINBDA6-64G-XI1 provides 64GB storage capacity using 3D TLC NAND flash technology, meeting the storage demands of modern OS images (Android/Linux).

eMMC 5.1 HS400 High-Speed Interface: SDINBDA6-64G-XI1 is compliant with JEDEC eMMC 5.1 standard with HS400 support, delivering sequential read speeds up to 310MB/s and sequential write speeds up to 150MB/s.

iNAND IX EM132 Industrial-Grade Embedded Storage: SDINBDA6-64G-XI1 is part of SanDisk's iNAND IX EM132 series, designed for industrial applications with high reliability and endurance. SDINBDA6-64G-XI1 features SmartSLC cache technology for enhanced burst write performance and data persistence.

Ultra-Compact BGA-153 Package: TFBGA-153 package with dimensions of only 11.5mm × 13mm × 1.0mm.

Wide Voltage & Industrial Temperature Range: SDINBDA6-64G-XI1 supports 2.7V to 3.6V operating voltage with -40℃ to +85℃ industrial temperature range for demanding environments.

Advanced Flash Management Firmware: SDINBDA6-64G-XI1 integrates SmartSLC cache, Power Immunity, ECC, Wear Leveling, and Bad Block Management for data integrity and long-term reliability.

Thermal Management: SDINBDA6-64G-XI1 supports auto-throttling to prevent overheating in fanless enclosures.

SDINBDA6-64G-XI1 Applications

The SDINBDA6-64G-XI1 eMMC chip is widely used in:

Industrial Control & Automation: SDINBDA6-64G-XI1 supports PLCs, industrial PCs, HMI, industrial motherboards

Outdoor IoT & Edge Computing: Outdoor kiosks, industrial IoT gateways, edge computing nodes, smart sensors

Medical Devices: SDINBDA6-64G-XI1 is used in patient monitors, diagnostic equipment, portable medical instruments

Communications & Networking: Routers, switches, base stations, optical modules

Smart Metering: SDINBDA6-64G-XI1 is suitable for smart electricity meters, water meters, gas meters

Embedded Systems: SBCs, system-on-modules, embedded Linux storage

SDINBDA6-64G-XI1 Advantages and Highlights

Industrial-Grade -40℃ to +85℃ Wide Temperature: Compared to consumer-grade eMMC (typically 0℃ to 70℃), the -40℃ to +85℃ range of SDINBDA6-64G-XI1 enables reliable operation in harsh industrial, outdoor, and vehicle environments.

High-Speed eMMC 5.1 HS400 Interface: SDINBDA6-64G-XI1 offers sequential read speeds up to 310MB/s and sequential write speeds up to 150MB/s for high-performance embedded storage bandwidth.

SmartSLC Cache Technology: SDINBDA6-64G-XI1 dynamically treats a portion of TLC NAND as SLC, providing a "burst buffer" for fast writes and improved endurance for OS logging.

Advanced Flash Management: Power Immunity protects data integrity during sudden power cuts, plus ECC, Wear Leveling, and Bad Block Management.

3D TLC NAND High-Density Storage: Cost-effective 64GB storage solution with 3D TLC NAND technology.

Ultra-Compact BGA-153 Package: SDINBDA6-64G-XI1 uses 11.5mm × 13mm × 1.0mm compact dimensions for high-density PCB designs.

Part Number Decoding: SDIN (iNAND EFD), B (BiCS 3D NAND), D (Industrial/Commercial line), A6 (Controller gen), 64G (64GB capacity), XI (Industrial wide temp -40℃ to +85℃), 1 (Standard tray/reel packaging).

Why Choose QIXINWEI

Years of experience in the electronics industry. Trusted by global customers.

Massive In-Stock Inventory – Ready to ship promptly

BOM Matching Service – One-stop solution, save time

PCBA Customization – Professional engineering team creates tailor-made solutions based on your needs

Cost-Effective & Efficient – Better channel, better cost

A dedicated team makes your procurement smoother.

Contact us for BOM quotes or PCBA inquiries

FAQ

1 What is the SDINBDA6-64G-XI1 chip
SDINBDA6-64G-XI1 is an industrial grade 64GB eMMC storage chip from SanDisk featuring a BGA153 package designed for high reliability embedded systems.

2 What is the storage capacity of this chip
SDINBDA6-64G-XI1 provides 64GB storage capacity which can satisfy the storage needs for embedded system firmware applications and massive amounts of data.

3 What package and physical dimensions does it use
SDINBDA6-64G-XI1 uses a BGA153 package fully compliant with JEDEC eMMC industrial standards with a compact footprint suitable for high density PCBA designs.

4 Which storage interface standard does it support
SDINBDA6-64G-XI1 supports the eMMC 5 point 1 high speed interface standard and is backward compatible with eMMC 5 point 0 communicating via a standard 8 bit parallel data bus with the host controller.

5 How is its read and write performance
SDINBDA6-64G-XI1 supports HS400 high speed transmission mode with a theoretical data transfer rate up to 400 megabytes per second offering excellent fast boot and efficient data read write capabilities.

6 What are the main application scenarios
SDINBDA6-64G-XI1 is widely used in various embedded Linux or Android devices such as smart set top boxes smart TVs industrial PLC controllers IoT gateways and automotive infotainment systems.

7  What are the operating temperature range and reliability
As an industrial grade version, SDINBDA6-64G-XI1 has an operating temperature range from minus 40 degrees Celsius to plus 85 degrees Celsius ensuring high reliability and long lifespan suitable for harsh industrial environments.

8 What are the power supply voltage requirements
For SDINBDA6-64G-XI1, the main power supply VCC supports 2 point 7 volts to 3 point 6 volts while the I/O interface power supply VCCQ supports 1 point 8 volts or 3 point 3 volts dual voltage modes to flexibly adapt to different host controller IO levels.

9 What are the design considerations when using this chip
When designing with SDINBDA6-64G-XI1, during PCB design strict trace length matching for the eMMC lines especially the clock signal and data strobe signal is required and necessary pull up resistors and decoupling capacitors must be added to ensure signal integrity at HS400 high frequency mode.

10  How to program firmware onto this chip
For SDINBDA6-64G-XI1, firmware can be programmed online via the eMMC protocol supported by the host controller or pre programmed offline using professional programmers before surface mounting and the chip supports standard erase write and verify operations.