RK3308H3 Rockchip Quad-Core Cortex-A35 Smart Voice Processor with Integrated 512MB DDR3 Audio Codec VAD TQFP-128

RK3308H3 is a highly integrated smart voice processor. The RK3308H3 features on-chip 512 MB DDR3. For compact smart speakers, RK3308H3 is the perfect choice. The RK3308H3 supports quad-core A35 performance. We recommend RK3308H3 for IoT voice applications. Choosing RK3308H3 ensures ultra-low power standby.

RK3308H3 Product Overview

RK3308H3 is a highly integrated quad-core Arm Cortex-A35 smart voice processor from Rockchip in a TQFP-128 package. It integrates 512 MB DDR3 memory on-chip, eliminating the need for external DRAM and greatly simplifying PCB layout while reducing BOM cost. The chip features a 24-bit/192 kHz audio codec, hardware Voice Activity Detection (VAD), 4 analog MICs, 2 PDM DMICs, 8-channel I2S/TDM, USB 2.0 OTG, 10/100M Ethernet MAC, and SPI Flash/SDMMC boot. Supporting Linux/RTOS with microwatt-level VAD standby, the RK3308H3 is built for space- and cost-sensitive applications such as smart speakers, smart home panels, voice recorders, storytelling machines, and in-vehicle voice assistants.

RK3308H3 Core Features

RK3308H3 CPU: Quad-core Arm Cortex-A35 at 1.3 GHz

RK3308H3 Integrated Memory: On-chip 512 MB DDR3, no external DRAM required

RK3308H3 Storage Boot: SPI Flash, eMMC 4.5/5.0, SD/SDIO

RK3308H3 Audio: 24-bit/192 kHz DAC/ADC, 4× analog MIC, 2× PDM DMIC, 8-ch I2S/TDM, SPDIF out

RK3308H3 Hardware VAD: Ultra-low-power voice activity detection for standby wake-up

RK3308H3 Ethernet: 10/100M Ethernet MAC (external PHY required)

RK3308H3 USB: USB 2.0 OTG

RK3308H3 Peripherals: 6× UART, 4× I2C, 2× SPI, 8× PWM, 6× SAR-ADC

RK3308H3 Package: TQFP-128 (14×14 mm)

RK3308H3 Temperature Range: -40°C to 85°C

RK3308H3 Applications

RK3308H3 Smart Speakers: Built-in 512 MB DDR3 enables ultra-compact designs for size-sensitive speakers

RK3308H3 Smart Home Panels: All-in-one voice and display terminals with minimal PCB complexity

RK3308H3 Voice Recorders & Translators: Multi-mic processing without external memory, ideal for miniaturization

RK3308H3 In-Vehicle Voice Assistants: Wide-temp operation and integrated memory for vibration-prone environments

RK3308H3 Battery-Powered Voice Devices: Single-chip core functions with hardware VAD for long standby

RK3308H3 Key Advantages

RK3308H3 On-Chip 512 MB DDR3: Runs Linux and voice algorithms without external memory, dramatically simplifying design

RK3308H3 Quad-Core A35 Performance: 1.3 GHz provides ample headroom for complex voice interactions

RK3308H3 One-Stop Audio Solution: Integrates high-precision 24-bit codec, multiple mics, and rich I2S connectivity

RK3308H3 Ultra-Low Power: Hardware VAD enables microwatt standby, extending battery life

RK3308H3 Industrial Grade: -40°C to 85°C for demanding environments

RK3308H3 Production-Friendly Package: TQFP-128 reduces PCB layers and assembly difficulty

RK3308H3 Complete Development Support: Rockchip Linux/RTOS SDK and comprehensive documentation accelerate time-to-market

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FAQ

1. What is RK3308H3?
RK3308H3 is a high-performance quad-core application processor from Rockchip, built on a 28nm process. It features a quad-core 64-bit ARM Cortex-A35 CPU and is designed for intelligent voice interaction, audio input/output processing, and other digital multimedia applications. RK3308H3 is an upgraded version of RK3308H (based on RK3308B), with the integrated memory changed from DDR2 to DDR3L.

2. What are the key specifications of RK3308H3?
Quad-core 64-bit ARM Cortex-A35 processor, up to 1.3GHz; supports ARM Neon SIMD engine acceleration with integrated VFPv4 hardware floating-point coprocessor; supports DDR3/DDR3L/DDR2/LPDDR2 memory. Integrated high-performance Audio CODEC with 8-channel ADC and 2-channel DAC.

3. What package does RK3308H3 use?
TFBGA-355 package (not TQFP-128), with 0.65mm ball pitch and chip size of 16mm × 16mm.

4. What applications is RK3308H3 suitable for?
Designed specifically for intelligent voice interaction devices, including smart speakers, voice assistants, audio players, conference systems, in-vehicle entertainment, smart home appliances, and digital multimedia applications.

5. What development tools support RK3308H3?
Rockchip's Linux SDK. The SDK supports multiple intelligent voice recognition SDKs including DuerOS, Alexa, iFlytek, and AISpeech. Supports various AI and IoT operating systems.

6. What is the operating temperature range of RK3308H3?
RK3308H3 is a commercial-grade chip. Please refer to the official datasheet for the exact temperature specifications. The chip features low-power design, suitable for power-sensitive smart audio devices.

7. Does RK3308H3 have an NPU?
No. RK3308H3 is a CPU-only voice processing chip with no dedicated NPU, no GPU, and no video encode/decode modules — focused purely on audio processing and voice interaction. AI voice recognition is primarily handled through cloud-based voice SDKs.

8. What is the audio processing capability of RK3308H3?
RK3308H3 features powerful audio processing: integrated high-performance Audio CODEC with 8-channel ADC and 2-channel DAC; directly supports up to 8-channel analog MIC array + echo reference without external ADC; built-in hardware VAD (Voice Activity Detection) module supporting low-power voice wake-up; supports I2S, PCM, TDM, PDM, SPDIF, HDMI ARC, and other audio interfaces. Supports AEC (Acoustic Echo Cancellation), Beamforming, and other voice enhancement technologies.

9. What is the difference between RK3308H3 and RK3308H?
Both are integrated-memory versions of the RK3308 series. Key difference: RK3308H integrates 64MB DDR2 memory, while RK3308H3 integrates 256MB (128M×16bit) DDR3L memory. IO configuration for RK3308H3 is the same as RK3308H. RK3308H3 also adds a ZQ signal (Pin D10, pull-down 240R, operating voltage 1.35V).

10. What peripheral interfaces does RK3308H3 support?
Supports SDIO 3.0 (for external Wi-Fi/BT modules), 10/100Mbps RMII MAC controller (with pin sharing with VOP), 1×USB 2.0 OTG and 1×USB 2.0 HOST. Display interface supports VOP (Video Output Processor) with RGB666/RGB565, up to 1080P output. Storage boot options include NAND, SPI Flash/SPI NAND, eMMC, and SDMMC. Also supports 3×SPI, 4×I2C, 5×UART (with pin sharing), ADC, and OTP memory.