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GD32E230F4V6TR GigaDevice ARM Cortex-M23 32-bit Microcontroller MCU LGA-20
GD32E230F4V6TR Product Overview
The GD32E230F4V6TR is a 32-bit general-purpose microcontroller (MCU) from GigaDevice, built on the ARM Cortex-M23 core and belonging to the GD32E230 Value Line product series. Housed in a compact LGA-20(3x3mm) package with 15 I/O pins, the GD32E230F4V6TR delivers maximum efficiency with a 72MHz maximum frequency and 0-2 wait-state Flash access. As a representative of the Value Line products in the GD32 MCU family, the GD32E230F4V6TR delivers 32-bit Cortex-M23 performance at near 8-bit MCU cost, providing an ideal entry-level upgrade path from 8-bit/16-bit to 32-bit Cortex-M23 architecture with the GD32E230F4V6TR.
GD32E230F4V6TR Key Features
High-Efficiency ARM Cortex-M23 Core: The GD32E230F4V6TR features an ARM Cortex-M23 processor based on the Armv8-M architecture, an energy-efficient processor with very low gate count. The GD32E230F4V6TR operates at up to 72MHz. The GD32E230F4V6TR includes a single-cycle multiplier and 17-cycle divider, delivering high energy efficiency through a small but powerful instruction set and extensively optimized design.
Memory Configuration: The GD32E230F4V6TR is equipped with 16KB on-chip Flash and 4KB SRAM.
Ultra-Compact LGA Package: The GD32E230F4V6TR comes in an LGA-20(3x3mm) package with 15 I/O pins, ideal for space-constrained PCB designs.
Ultra-Wide Voltage & Temperature Range: The GD32E230F4V6TR supports 1.8V to 3.6V ultra-wide operating voltage and -40℃ to +85℃ industrial temperature range.
Rich Analog Peripherals: The GD32E230F4V6TR integrates a 12-bit ADC (up to 9 channels) and 1 comparator.
Comprehensive Timer Resources: The GD32E230F4V6TR provides up to five 16-bit general-purpose timers, one basic timer, and one PWM advanced timer.
Standard Communication Interfaces: The GD32E230F4V6TR supports up to 2 SPI, 2 I2C, 2 USART, and 1 I2S.
Rich On-Chip Resources: The GD32E230F4V6TR has a built-in on-chip temperature sensor, DMA, watchdog timer, LIN bus protocol, PWM, IrDA, and RTC.
Low-Power Process: The GD32E230F4V6TR is manufactured using 55nm low-power technology for ultra-low cost applications.
Multiple Low-Power Modes: The GD32E230F4V6TR offers various power-saving modes for flexible optimization between wake-up latency and power consumption.
GD32E230F4V6TR Applications
With its exceptional cost-performance ratio, high energy efficiency, and compact LGA package, the GD32E230F4V6TR is widely used in:
Industrial Control: The GD32E230F4V6TR enables industrial automation, power monitoring and alarm systems
Motor Control: The GD32E230F4V6TR is ideal for BLDC motor control, power tools
Consumer Electronics: The GD32E230F4V6TR suits smart home devices, handheld devices, gaming peripherals, small appliances
IoT Nodes: The GD32E230F4V6TR can be used in smart sensors, data acquisition and processing terminals
TWS Charger Cases: The GD32E230F4V6TR serves as the main MCU for single-cell lithium battery charge/discharge management
Medical Devices: The GD32E230F4V6TR is suitable for portable medical instruments
GD32E230F4V6TR Key Advantages
High Energy Efficiency: The GD32E230F4V6TR's 72MHz Cortex-M23 core offers code execution efficiency exceeding comparable products at the same frequency.
LGA-20 Ultra-Compact Package: The GD32E230F4V6TR features a 3×3mm ultra-small footprint with 15 I/O pins – ideal for space-constrained portable devices and embedded systems.
Rich Peripheral Integration: The GD32E230F4V6TR integrates a 12-bit ADC, comparator, multiple timers, and SPI, I2C, USART communication interfaces on a single chip – greatly simplifying peripheral circuit design.
Industrial-Grade Reliability: The GD32E230F4V6TR operates across a -40℃ to +85℃ wide temperature range, suitable for harsh industrial environments.
Mature Ecosystem: The GD32E230F4V6TR supports Keil, IAR, and other mainstream IDEs with official firmware libraries and abundant development resources.
Stable Domestic Supply Chain: GigaDevice, as a leading domestic MCU supplier, ensures stable and reliable supply for the GD32E230F4V6TR.
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FAQ
1 What is the GD32E230F4V6TR chip
The GD32E230F4V6TR is a high performance 32 bit microcontroller from GigaDevice based on the ARM Cortex M23 core featuring an LGA 20 Land Grid Array package designed for ultra low power consumption and compact size.
2 What are the core frequency Flash and SRAM capacities
The GD32E230F4V6TR reaches a maximum main frequency of 72MHz with 16KB of Flash memory and 4KB of SRAM onboard meeting the basic code and data storage needs of lightweight embedded control applications.
3 What package type and pin configuration does it use
The GD32E230F4V6TR adopts an LGA 20 package with 20 pins. This package features a land grid array on the bottom offering high integration and a very small footprint on the PCB.
4 What are the operating voltage and temperature ranges
The GD32E230F4V6TR operates at 2 point 6V to 3 point 6V and the temperature range meets the industrial standard of minus 40 degrees Celsius to plus 85 degrees Celsius.
5 Which mainstream chip can this chip replace
The GD32E230F4V6TR is highly compatible with the STM32F031F4 series in both hardware pinout and low level software offering a mature and cost effective domestic replacement in this specific package configuration.
6 What peripheral communication interfaces does it support
The GD32E230F4V6TR integrates multiple USART serial ports I2C interfaces SPI interfaces and is equipped with a 12 bit analog to digital converter ADC and advanced timers.
7 What IDEs and programming methods are supported
The GD32E230F4V6TR fully supports mainstream embedded IDEs such as Keil MDK IAR EWARM and GCC and the official standard peripheral libraries and HAL libraries are comprehensive for easy migration and development.
8 What application scenarios is this chip suitable for
With its extremely compact LGA package and low power consumption the GD32E230F4V6TR is widely used in space constrained motor control precision sensor acquisition portable medical devices TWS earbuds and various battery powered consumer electronics.
9 What are the design considerations for the LGA package
The bottom LGA pads of the GD32E230F4V6TR are densely distributed. The PCB design must strictly follow the recommended pad dimensions for stencil openings and ensure the bottom ground pad is reliably connected for heat dissipation. Precise reflow soldering processes are required during assembly.
10 What debugging and firmware download interface is supported
The GD32E230F4V6TR supports the standard SWD serial wire debug interface requiring only two pins SWDIO and SWCLK for online emulation breakpoint debugging and firmware programming via an emulator during development.
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- Model:
- GD32E230F4V6TR
- Brand:
- GigaDevice
- Core Processor:
- ARM Cortex-M23
- Max Frequency:
- 72MHz
- Flash Memory:
- 16KB
- SRAM Size:
- 4KB
- Package:
- LGA-20
- I/O Pins:
- 15
- Operating Temperature:
- -40℃ ~ +85℃
- Operating Voltage:
- 1.8V ~ 3.6V