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GD25Q64ESIG GigaDevice 64Mbit SPI NOR Flash 133MHz 2.7-3.6V SOP-8-208mil Tube Industrial Grade Memory IC

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GD25Q64ESIG is a top choice for 64Mbit SPI NOR Flash. We highly recommend the GD25Q64ESIG for industrial applications. The GD25Q64ESIG provides reliable storage at 133MHz, allowing the GD25Q64ESIG to excel in high-speed performance. Selecting the GD25Q64ESIG means you choose a high-endurance memory solution. In short, the GD25Q64ESIG is the optimal storage device for your embedded systems, because the GD25Q64ESIG perfectly balances speed, power, and reliability.

GD25Q64ESIG Product Overview

The GD25Q64ESIG is a 64Mbit (8MB) industrial-grade SPI NOR Flash memory chip from GigaDevice, housed in a SOP-8-208mil wide-body package (5.23×5.28mm). The GD25Q64ESIG supports standard SPI, dual SPI, and quad SPI interfaces with a maximum clock frequency of 133MHz, achieving data transfer rates up to 532Mbit/s in quad SPI mode. The GD25Q64ESIG operates from 2.7V to 3.6V with a standby current of only 12µA and a deep power-down current of 1µA. With 100,000 program/erase cycles and 20 years of data retention, the GD25Q64ESIG operates over an industrial temperature range of -40℃ to +85℃. The GD25Q64ESIG features a uniform sector architecture with 4KB sector erase and a page programming time of 500µs (typical). The GD25Q64ESIG and GD25Q64ESIGR are the same model, differing only in packaging: ESIG is tube packaging, ESIGR is tape and reel.


GD25Q64ESIG Core Features

64Mbit Storage Capacity: The GD25Q64ESIG offers 64Mbit (8MB) storage space, organized as 8M × 8.

SPI Quad Interface: The GD25Q64ESIG supports standard SPI, dual SPI, and quad SPI interfaces. The GD25Q64ESIG achieves data transfer rates up to 532Mbit/s in Quad I/O mode and up to 266Mbit/s in dual I/O mode.

133MHz High-Speed Clock: The GD25Q64ESIG delivers a maximum clock frequency of 133MHz with an access time of only 7ns.

Wide Operating Voltage: The GD25Q64ESIG operates from a 2.7V to 3.6V supply, making it compatible with 3.3V systems.

Ultra-Low Standby Current: The GD25Q64ESIG consumes a standby current of only 12µA.

High Reliability: The GD25Q64ESIG guarantees 100,000 program/erase cycles with 20 years of data retention.

Fast Program and Erase: The GD25Q64ESIG delivers a page programming time of 500µs (typical); 4KB sector erase in 45ms (typical); 32KB block erase in 150ms and 64KB block erase in 250ms.

Uniform Sector Architecture: The GD25Q64ESIG uses 4KB sector erase granularity for efficient file system management.

Multiple Write Protection Functions: The GD25Q64ESIG provides hardware write protection (WP# pin), software write protection, absolute write protection, and write enable latch.

Wide Operating Temperature: The GD25Q64ESIG operates reliably across an industrial temperature range of -40℃ to +85℃.

SOP-8-208mil Wide-Body Package: The GD25Q64ESIG is housed in a wide-body 8-pin SOP package (208mil, 5.23×5.28mm), offering wider pad spacing than standard SOP-8 (150mil) for easier hand-soldering and PCB routing.

Packaging Difference: The GD25Q64ESIG is tube packaging, while GD25Q64ESIGR is tape and reel.


GD25Q64ESIG Applications

The GD25Q64ESIG is widely used in embedded systems and firmware storage, industrial control and automation, communication equipment (routers, switches, 5G base stations), IoT devices, automotive electronics (in-vehicle infotainment, dashcams), consumer electronics and portable devices, smart wearables and AMOLED display phones. The GD25Q64ESIG is a trusted choice for applications requiring reliable non-volatile storage.


GD25Q64ESIG Key Advantages

GigaDevice Original Quality with Stable Supply: The GD25Q64ESIG is a classic SPI NOR Flash product from GigaDevice, offering a stable domestic supply chain. Customers trust the GD25Q64ESIG for consistent quality and availability.

133MHz High-Speed Quad SPI for XiP Performance: The GD25Q64ESIG delivers up to 133MHz clock frequency with quad SPI interface, achieving data transfer rates up to 532Mbit/s. The GD25Q64ESIG with 7ns access time meets the demands of XiP (eXecute In Place) applications.

Ultra-Low Power and Industrial Wide Temperature: The GD25Q64ESIG features a standby current of only 12µA. The GD25Q64ESIG operates across -40℃ to +85℃ for harsh industrial and outdoor environments.

Multiple Write Protections for Data Integrity: The GD25Q64ESIG provides hardware write protection (WP# pin), software write protection, absolute write protection, and write enable latch, ensuring data security in the GD25Q64ESIG.

High Reliability and Long Lifespan: The GD25Q64ESIG offers 100,000 program/erase cycles with 20 years of data retention, making the GD25Q64ESIG ideal for long-lifecycle products.

SOP-8-208mil Wide-Body Package: The GD25Q64ESIG comes in a SOP-8-208mil wide-body package (5.23×5.28mm), offering wider pad spacing than standard SOP-8 for easier hand-soldering and PCB routing with the GD25Q64ESIG.

Flexible Packaging Options: The GD25Q64ESIG (tube) and GD25Q64ESIGR (tape and reel) provide flexible packaging for different production needs, ensuring the GD25Q64ESIG can be integrated into any manufacturing flow.


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FAQ

1. What is GD25Q64ESIG?

The GD25Q64ESIG is a 64Mbit (8MB) industrial-grade SPI NOR Flash memory from GigaDevice, available in an SOP-8-208mil package. The GD25Q64ESIG supports standard SPI, dual SPI, and quad SPI interfaces, and the GD25Q64ESIG has become a widely used general-purpose storage chip in embedded systems due to its balanced electrical performance, rich features, and stable operation.

2. What are the key specifications of GD25Q64ESIG?

  • Memory Size: The GD25Q64ESIG provides 64Mbit (8M × 8)

  • Clock Frequency: The GD25Q64ESIG supports up to 133MHz

  • Access Time: The GD25Q64ESIG delivers 7ns

  • Supply Voltage: The GD25Q64ESIG operates at 2.7V ~ 3.6V

  • Operating Temperature: The GD25Q64ESIG works at -40°C ~ +85°C (industrial grade)

  • Standby Current: The GD25Q64ESIG consumes 12µA typical

  • Endurance: The GD25Q64ESIG guarantees 100,000 program/erase cycles minimum

  • Data Retention: The GD25Q64ESIG provides 20 years typical

  • Page Program Time: The GD25Q64ESIG completes page program in 500µs

  • Block Erase Time (64KB): The GD25Q64ESIG erases a 64KB block in 250ms

3. What package does GD25Q64ESIG use?

The GD25Q64ESIG uses an SOP-8-208mil package (8-SOIC, 0.209"/5.30mm width). The GD25Q64ESIG standard packaging is Tube, with 95 pieces per tube. The GD25Q64ESIG is a surface-mount device (SMD) and is RoHS compliant.

4. What applications is GD25Q64ESIG suitable for?

The GD25Q64ESIG is widely used in smart wearables, AMOLED camera modules, IoT devices, automotive electronics, and 5G base stations. In automotive navigation systems, the GD25Q64ESIG achieves 533Mbps data throughput in QSPI mode, significantly reducing map data loading time. The GD25Q64ESIG is AEC-Q100 certified for automotive applications.

5. What development tools support GD25Q64ESIG?

The GD25Q64ESIG is a standard SPI NOR Flash chip, requiring no dedicated software tools. Designers can refer to the GD25Q64E series datasheet available on the GigaDevice website. SPI/QSPI drivers from mainstream MCUs support the GD25Q64ESIG. Some FPGA vendors also provide official support for GD25 series Flash.

6. What is the operating temperature range of GD25Q64ESIG?

The GD25Q64ESIG operates across -40°C to +85°C (ambient temperature TA). The GD25Q64ESIG storage temperature range is -65°C to +150°C. The GD25Q64ESIG is an industrial-grade device suitable for harsh environments.

7. What are the key features of GD25Q64ESIG?

  • High-speed quad SPI interface: The GD25Q64ESIG delivers data throughput up to 533Mbps in QSPI mode

  • XIP (eXecute-In-Place) support: The GD25Q64ESIG allows code execution directly from Flash

  • Multiple write protection mechanisms: The GD25Q64ESIG provides hardware write protection, software write protection, write enable latch, and absolute write protection

  • Low power consumption: The GD25Q64ESIG standby current is as low as 12µA

  • High reliability: The GD25Q64ESIG offers 100,000 erase/write cycles + 20-year data retention

  • ECC error correction and CRC check: The GD25Q64ESIG detects and corrects bit errors

8. What interfaces and transfer rates does GD25Q64ESIG support?

  • Standard SPI: The GD25Q64ESIG uses SCLK, CS#, SI, SO

  • Dual SPI: The GD25Q64ESIG supports dual I/O transmission

  • Quad SPI: The GD25Q64ESIG achieves quad I/O data transfer up to 532Mbit/s

  • Operation Timing: The GD25Q64ESIG delivers Page Program 500µs, Sector Erase (4KB) 45ms, Block Erase (64KB) 250ms

9. What is the difference between GD25Q64ESIG and GD25Q64ESIGR?

The GD25Q64ESIG and GD25Q64ESIGR have identical core specifications (64Mbit capacity, 133MHz frequency, SOP-8-208mil package, 100,000 endurance cycles, etc.). The main difference lies in packaging: The GD25Q64ESIG is Tube packaging, while GD25Q64ESIGR is Tape & Reel packaging.

10. What are the design considerations when using GD25Q64ESIG?

  • Power decoupling: Place a 0.1µF ceramic capacitor near the VCC pin of the GD25Q64ESIG for stable power

  • Pull-up resistors: Add 10kΩ pull-up resistors on CS, SCLK, and MOSI lines of the GD25Q64ESIG

  • WP# and HOLD# pins: When using the GD25Q64ESIG, tie these pins to VCC (high) if not used — do not leave floating

  • Quad SPI mode: The GD25Q64ESIG must be configured via the status register; default is standard SPI mode

  • PCB layout: The GD25Q64ESIG SOP-8-208mil package (5.30mm width) is suitable for hand soldering and reflow soldering

Model:
GD25Q64ESIG
Brand:
GigaDevice
Memory Type:
NOR Flash (Non-Volatile)
Memory Size:
64Mbit (8MB)
Memory Organization:
8M × 8
Interface:
SPI - Quad I/O
Clock Frequency:
Up to 133MHz
Operating Voltage:
2.7V – 3.6V
Package:
SOP-8-208mil
Relation to GD25Q64ESIGR:
Same model, packaging difference (ESIG tube / ESIGR tape & reel)
Applications:
Embedded Systems, Industrial Control, Communication Equipment, IoT, Automotive Electronics, Consumer Electronics
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