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GD25Q128ESIG GigaDevice 128Mbit SPI NOR Flash 133MHz 2.7-3.6V SOP-8-208mil Industrial Grade Memory IC
GD25Q128ESIG is a reliable 128Mbit SPI NOR Flash. For industrial solutions, the GD25Q128ESIG is highly recommended. The GD25Q128ESIG offers 133MHz performance, allowing the GD25Q128ESIG to handle high-speed data easily. Choosing the GD25Q128ESIG ensures long-term storage security. In a word, the GD25Q128ESIG is your ideal choice for robust embedded storage.
GD25Q128ESIG Product Overview
The GD25Q128ESIG is a 128Mbit (16MB) industrial-grade SPI NOR Flash memory chip from GigaDevice, housed in a SOP-8-208mil wide-body package (5.23×5.28mm). It supports standard SPI, dual SPI, and quad SPI interfaces with a maximum clock frequency of 133MHz, achieving data transfer rates up to 532Mbit/s in quad SPI mode. The chip operates from 2.7V to 3.6V with a standby current of only 14µA and a deep power-down current of 1µA. With 100,000 program/erase cycles and 20 years of data retention, the GD25Q128ESIG operates over an industrial temperature range of -40℃ to +85℃. The chip features a uniform sector architecture with 4KB sector erase (45ms) for efficient file system management.
GD25Q128ESIG Core Features
128Mbit Large Storage Capacity: 128Mbit (16MB) storage space, organized as 16M × 8, with 256-byte page size.
SPI Quad Interface: Supports standard SPI, dual SPI, and quad SPI interfaces. Quad I/O mode achieves data transfer rates up to 532Mbit/s, dual I/O mode up to 266Mbit/s.
133MHz High-Speed Clock: Maximum clock frequency of 133MHz with an access time of only 7ns.
Wide Operating Voltage: 2.7V to 3.6V supply, compatible with 3.3V systems.
Ultra-Low Power Consumption: Standby current of only 14µA, deep power-down current of 1µA.
High Reliability: 100,000 program/erase cycles with 20 years of data retention.
Fast Program and Erase: Page programming time of 0.5ms (500µs); 4KB sector erase time of 45ms; 32KB block erase time of 150ms and 64KB block erase time of 250ms; chip erase time of 50s.
Uniform Sector Architecture: 4KB sector erase granularity for efficient file system management.
Multiple Write Protection Functions: Hardware write protection, software write protection, absolute write protection, and write enable latch.
Advanced Security Features: 128-bit unique ID per device, 3×1024-byte security registers with OTP locks.
XiP (eXecute In Place) Support: Supports XiP operation with 133MHz high-speed quad SPI reads for direct code execution.
Wide Operating Temperature: Industrial temperature range of -40℃ to +85℃.
SOP-8-208mil Wide-Body Package: Wide-body 8-pin SOP package (208mil, 5.23×5.28mm), offering wider pad spacing than standard SOP-8 for easier hand-soldering and PCB routing.
Same Model as GD25Q128ESIGR, Packaging Difference: GD25Q128ESIG and GD25Q128ESIGR are the same model, differing only in packaging: ESIG is tube packaging, ESIGR is tape and reel.
GD25Q128ESIG Applications
The GD25Q128ESIG is widely used in embedded systems, industrial control and automation, communication equipment, IoT devices, automotive electronics, consumer electronics and portable devices, and Human-Machine Interfaces (HMI).
GD25Q128ESIG Key Advantages
128Mbit Highest Density in 8-Pin SOIC Package: 128Mbit is the highest density available in the 8-pin SOIC package, providing 16MB storage without changing PCB footprint.
GigaDevice Original Quality with Stable Supply: A classic SPI NOR Flash product from GigaDevice, offering stable supply as a domestic solution.
133MHz High-Speed Quad SPI for XiP Performance: Up to 133MHz clock frequency with quad SPI interface delivers data transfer rates up to 532Mbit/s. 7ns access time meets the demands of XiP applications.
Ultra-Low Power and Industrial Wide Temperature: Standby current of only 14µA, deep power-down current of 1µA. Operating temperature -40℃ to +85℃, storage temperature -65℃ to 150℃.
Multiple Write Protections and Security Features: Hardware/software/absolute write protection, 128-bit unique ID, and 3×1024-byte security registers with OTP locks.
High Reliability and Long Lifespan: 100,000 program/erase cycles with 20 years of data retention.
SOP-8-208mil Wide-Body Package: SOP-8-208mil package (5.23×5.28mm) offers wider pad spacing for easier hand-soldering and PCB routing.
Flexible Packaging Options: GD25Q128ESIG (tube) and GD25Q128ESIGR (tape and reel) for different production needs.
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FAQ
1. What is GD25Q128ESIG？
GD25Q128ESIG is a 128Mbit (16MB) SPI NOR Flash memory from GigaDevice, available in an SOP-8-208mil package. It supports standard SPI, dual SPI, and quad SPI interfaces with a unified sector architecture (4KB sectors + 32/64KB blocks). With its large capacity, high reliability, and low power consumption, it is widely used in various embedded systems.
2. What are the key specifications of GD25Q128ESIG？
Memory Size: 128Mbit (16M × 8)
Clock Frequency: Up to 133MHz
Interface: SPI (Standard/Dual/Quad)
Supply Voltage: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ +85°C (industrial grade)
Standby Current: 14µA typical
Deep Power-Down Current: 1µA typical
Endurance: 100,000 program/erase cycles minimum
Data Retention: 20 years typical
3. What package does GD25Q128ESIG use？
It uses an SOP-8-208mil package (8-SOIC, 0.209"/5.30mm width). Standard packaging is Tube, with 95 pieces per tube. Moisture Sensitivity Level is MSL 3 (168 hours). The device is RoHS compliant.
4. What applications is GD25Q128ESIG suitable for？
It is widely used in communication equipment, industrial automation control, consumer electronics and portable devices, IoT devices, automotive electronics, and 5G base stations. It supports XIP (eXecute-In-Place) operation, allowing code execution directly from Flash and reducing instruction fetch time.
5. What development tools support GD25Q128ESIG？
As a standard SPI NOR Flash chip, no dedicated software tools are required. Designers can refer to the GD25Q128E series datasheet available on the GigaDevice website. SPI drivers from mainstream MCUs support this device.
6. What is the operating temperature range of GD25Q128ESIG？
The operating temperature range is -40°C to +85°C (industrial grade). The storage temperature range is -65°C to +150°C.
7. What are the key features of GD25Q128ESIG？
High-speed quad SPI interface: Quad I/O data transfer up to 532Mbit/s
XIP (eXecute-In-Place) support: High-speed read reduces instruction fetch time
Multiple write protection mechanisms: Hardware write protection, software write protection, write enable latch, absolute write protection
Low power consumption: Standby current as low as 14µA, deep power-down as low as 1µA
High reliability: 100,000 erase/write cycles + 20-year data retention
128-bit Unique ID: Each device features a unique identifier
Flexible sector architecture: 4KB sectors + 32/64KB blocks
8. What interfaces and transfer rates does GD25Q128ESIG support？
Standard SPI: SCLK, CS#, SI, SO
Dual SPI: Transfer rate 266Mbit/s
Quad SPI: Transfer rate 532Mbit/s
Operation Timing (typical) : Page Program 0.5ms, Sector Erase (4KB) 45ms, Block Erase (32KB) 0.15s / (64KB) 0.25s, Chip Erase 50s
9. What is the difference between GD25Q128ESIG and GD25Q128ESIGR？
GD25Q128ESIG and GD25Q128ESIGR have identical core specifications (128Mbit capacity, 133MHz frequency, SOP-8-208mil package, 100,000 endurance cycles, etc.). The main difference lies in packaging: GD25Q128ESIG is Tube packaging, while GD25Q128ESIGR is Tape & Reel packaging. Both have identical function, pinout, and performance.
10. What are the design considerations when using GD25Q128ESIG？
Power decoupling: Place a 0.1µF ceramic capacitor near the VCC pin for stable power
Pull-up resistors: Add 10kΩ pull-up resistors on CS, SCLK, and MOSI lines
WP# and HOLD#/RESET# pins: Tie to VCC (high) if not used — do not leave floating
Quad SPI mode: Must be configured via the status register; default is standard SPI mode
Low-voltage protection: Write operations are automatically locked when supply voltage drops below threshold
PCB layout: SOP-8-208mil package (5.30mm width) is suitable for hand soldering and reflow soldering
- Model:
- GD25Q128ESIG
- Brand:
- GigaDevice
- Memory Type:
- NOR Flash (Non-Volatile)
- Memory Size:
- 128Mbit
- Memory Organization:
- 16M × 8
- Interface:
- SPI - Quad I/O
- Clock Frequency:
- Up to 133MHz
- Operating Voltage:
- 2.7V – 3.6V
- Package:
- SOP-8-208mil
- Relation to GD25Q128ESIGR:
- Same model, packaging difference (ESIG tube / ESIGR tape & reel)
- Applications:
- Embedded Systems, Industrial Control, Communication Equipment, IoT, Automotive Electronics, Consumer Electronics, HMI
