ESP32-S3 Chip Xtensa LX7 32-Bit Dual-Core Wi-Fi Bluetooth 5(LE) SoC 240MHz 45 GPIO QFN56

ESP32-S3 Product Overview

The ESP32-S3 is a low-power MCU-based system on a chip (SoC) from Espressif Systems, integrating 2.4GHz Wi-Fi and Bluetooth 5 (LE) wireless communication. Featuring an Xtensa® 32-bit LX7 dual-core processor running at up to 240MHz, it is equipped with 512KB SRAM and 384KB ROM in a QFN-56 (7×7mm) package with 45 programmable GPIOs, operating from 3.0V to 3.6V over a -40℃ to +105℃ temperature range. Manufactured on a low-power 40nm process, the ESP32-S3 delivers high RF performance, stability, versatility, and reliability with ultra-low power consumption for diverse application scenarios. The chip adds vector instructions for accelerating neural network computation and signal processing, making it ideal for AIoT applications such as wake-word detection, speech command recognition, face detection and recognition, smart home, smart appliances, smart control panels, and smart speakers.

ESP32-S3 Applications

Smart home control panels and voice interaction terminals

Industrial automation wireless sensor nodes

Camera video streaming and image recognition

USB devices and Wi-Fi + Bluetooth network cards

Generic low-power IoT sensor hubs and data loggers

Service robots and consumer electronics

FAQ

Q: How capable is ESP32-S3 for AI inference?
A: The Xtensa LX7 dual-core processor supports 128-bit SIMD instructions and a single-precision FPU, achieving 1181.60 CoreMark at 240MHz dual-core. Espressif provides ESP-DL and ESP-NN machine learning libraries for deploying quantized pre-trained models on-device, enabling voice wake-up, image classification, and vibration monitoring.

Q: What wireless protocols are supported?
A: 2.4GHz Wi-Fi (IEEE 802.11b/g/n) and Bluetooth 5 (LE) with Bluetooth Mesh. Wi-Fi and Bluetooth share an antenna with internal coexistence. Bluetooth transmit power reaches 20dBm in high-power mode.

Q: What is the package and pin count?
A: QFN56 (7×7 mm) package with 45 programmable GPIOs. Six GPIOs are allocated for in-package Flash or PSRAM, and four are strapping GPIOs. The ESP32-S3FH4R2 uses a QFNWB (7×7 mm) package.

Q: What is the difference between ESP32-S3 and ESP32?
A: ESP32-S3 uses a newer Xtensa LX7 dual-core architecture (LX6 in ESP32), supports SIMD instructions and larger in-package PSRAM. GPIO count increases to 45, adding USB OTG and USB Serial/JTAG. Bluetooth is upgraded to Bluetooth 5 (LE), but Classic Bluetooth (BR/EDR) is not supported.

Q: How do I choose a specific ESP32-S3 model?
A: Choose by in-package memory: ESP32-S3FN8 for 8MB Flash; ESP32-S3R8 for 8MB PSRAM; ESP32-S3RH2 for 2MB PSRAM; ESP32-S3RH6V for 1.8V 6MB PSRAM; ESP32-S3FH4R2 for compact QFNWB with 4MB Flash + 2MB PSRAM.

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