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AMD Xilinx Artix-7 Series Industrial FPGA XC7A35T-2FGG484I for High-Performance Embedded Applications

XC7A35T-2FGG484I Product Overview

The XC7A35T-2FGG484I is a high-performance Field Programmable Gate Array from AMD Xilinx in the Artix-7 series, manufactured on advanced 28nm HKMG process technology. This device features 33,280 logic cells, 5,200 CLB slices, 90 DSP slices, 1,800Kbits of block RAM, and 250 user I/O pins, with internal operating frequency up to 628MHz.

The XC7A35T-2FGG484I delivers exceptional performance-per-watt and rich I/O resources, featuring 4 high-speed GTP transceivers running up to 6.6Gb/s each with PCI Express Gen2 x4 support. This industrial-grade device operates from -40°C to 100°C and comes in a 23×23mm 484-pin FCBGA package. The Artix-7 series is optimized for low-power, cost-sensitive, high-throughput applications across industrial control, communications infrastructure, embedded vision, and medical imaging.


XC7A35T-2FGG484I Core Features

Logic and Memory Resources: 33,280 logic cells with 5,200 CLB slices and 6-input LUT architecture. 1,800Kbits of block RAM comprised of 100 18KB or 50 36KB blocks for data buffering and image processing

Digital Signal Processing: 90 DSP slices with 18x18 multipliers and 48-bit accumulators supporting high-performance filtering and FFT for embedded vision and baseband processing

High-Speed Serial Connectivity: 4 GTP transceiver channels up to 6.6Gb/s with total serial bandwidth of 211Gb/s, supporting PCIe, Gigabit Ethernet, and CPRI protocols

Flexible I/O Interface: 250 user I/O pins supporting 1.2V to 3.3V standards including LVTTL, LVCMOS, HSTL, SSTL, and LVDS for versatile peripheral connectivity

Clock Management: Integrated MMCM and PLL for clock synthesis, frequency scaling, phase shifting, and jitter filtering

Industrial Operating Temperature: -40°C to 100°C junction temperature range for outdoor equipment, industrial control, and 24/7 operation

Package and Process: 28nm HKMG CMOS process with 1.0V core voltage. 23×23mm 484-pin FCBGA package with 1.0mm ball pitch, RoHS 3 compliant


XC7A35T-2FGG484I Applications

Industrial Automation and Control: Wide temperature operation for PLC controllers, industrial robotics, and motion control systems requiring high reliability

Embedded Vision and Edge Computing: 90 DSP slices with 1.8Mbit block RAM for real-time image processing and machine vision applications

Communications and Networking: 4x 6.6Gb/s GTP transceivers supporting CPRI and Gigabit Ethernet for wireless base stations and protocol bridges

Medical Imaging: High DSP throughput and low power for ultrasound imaging and CT scanners

Test and Measurement: 250 I/Os supporting multiple standards for data acquisition and logic analyzers

System-on-Module: Standard FPGA device for SOMs with DDR3 memory and QSPI Flash integration


XC7A35T-2FGG484I Key Advantages

Industrial Grade Wide Temperature Reliability: -40°C to 100°C operating range for outdoor equipment and industrial applications requiring 24/7 stable operation

Exceptional Performance-Per-Watt: 28nm HKMG process delivers 33K logic cells and 90 DSP slices with low power consumption for energy-sensitive applications

Rich I/O and Transceiver Combination: 250 user I/Os with 4 GTP transceivers providing excellent I/O density and serial bandwidth for peripheral-intensive designs

PCIe Gen2 x4 Hard IP Support: Integrated PCIe block reduces development effort with complete protocol stack support

Comprehensive Development Ecosystem: Vivado design suite with complete IP core library, abundant documentation, and mature technical support


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AMD Xilinx Artix-7 Series Industrial FPGA XC7A35T-2FGG484I for High-Performance Embedded Applications AMD Xilinx Artix-7 FPGA XC7A35T-2FGG484I for Industrial Control and Embedded Vision ApplicationsAMD Xilinx Artix-7 Series Industrial FPGA XC7A35T-2FGG484I for High-Performance Embedded Applications AMD Xilinx Artix-7 FPGA XC7A35T-2FGG484I for Industrial Control and Embedded Vision ApplicationsAMD Xilinx Artix-7 Series Industrial FPGA XC7A35T-2FGG484I for High-Performance Embedded Applications AMD Xilinx Artix-7 FPGA XC7A35T-2FGG484I for Industrial Control and Embedded Vision ApplicationsAMD Xilinx Artix-7 Series Industrial FPGA XC7A35T-2FGG484I for High-Performance Embedded Applications AMD Xilinx Artix-7 FPGA XC7A35T-2FGG484I for Industrial Control and Embedded Vision ApplicationsAMD Xilinx Artix-7 Series Industrial FPGA XC7A35T-2FGG484I for High-Performance Embedded Applications AMD Xilinx Artix-7 FPGA XC7A35T-2FGG484I for Industrial Control and Embedded Vision ApplicationsAMD Xilinx Artix-7 Series Industrial FPGA XC7A35T-2FGG484I for High-Performance Embedded Applications AMD Xilinx Artix-7 FPGA XC7A35T-2FGG484I for Industrial Control and Embedded Vision ApplicationsAMD Xilinx Artix-7 Series Industrial FPGA XC7A35T-2FGG484I for High-Performance Embedded Applications AMD Xilinx Artix-7 FPGA XC7A35T-2FGG484I for Industrial Control and Embedded Vision ApplicationsAMD Xilinx Artix-7 Series Industrial FPGA XC7A35T-2FGG484I for High-Performance Embedded Applications AMD Xilinx Artix-7 FPGA XC7A35T-2FGG484I for Industrial Control and Embedded Vision ApplicationsAMD Xilinx Artix-7 Series Industrial FPGA XC7A35T-2FGG484I for High-Performance Embedded Applications AMD Xilinx Artix-7 FPGA XC7A35T-2FGG484I for Industrial Control and Embedded Vision ApplicationsAMD Xilinx Artix-7 Series Industrial FPGA XC7A35T-2FGG484I for High-Performance Embedded Applications AMD Xilinx Artix-7 FPGA XC7A35T-2FGG484I for Industrial Control and Embedded Vision ApplicationsAMD Xilinx Artix-7 Series Industrial FPGA XC7A35T-2FGG484I for High-Performance Embedded Applications AMD Xilinx Artix-7 FPGA XC7A35T-2FGG484I for Industrial Control and Embedded Vision Applications

FAQ:

  1. What is the XC7A35T-2FGG484I and its key specifications?
    This is an AMD Xilinx Artix‑7 FPGA built on a 28 nm process, optimized for high‑performance embedded applications. It provides 33,280 logic cells (≈33K), 1,800 Kb of block RAM (≈225 KB), and 90 DSP48E1 slices. It includes 5 clock management tiles (CMTs), a hardened PCIe Gen2 x4 interface, and 4 GTP transceivers (up to 6.6 Gbps). The device is housed in a 484‑pin FGG484 BGA package (23×23 mm, 1.0 mm pitch) with 250 user I/O pins. The “‑2” speed grade delivers balanced performance, and the “I” suffix guarantees reliable operation over ‑40 °C to +100 °C. It is an excellent entry‑to‑mid‑range FPGA for industrial, automotive, and communications systems that need high‑speed serial connectivity and abundant logic resources in a compact footprint.

  2. How does the XC7A35T compare to the XC7A50T? What are the resource differences?
    Both are Artix‑7 FPGAs and share the same core features: 4 GTP transceivers, PCIe Gen2 x4, and identical I/O resources. The key difference is logic capacity: the XC7A50T provides 52,160 logic cells (vs 33,280) and 120 DSP slices (vs 90), along with 2,700 Kb of block RAM (vs 1,800 Kb). Both are pin‑compatible in the FGG484 package, so you can start with the A35T and later migrate to the A50T if you need more logic or DSP. The A35T is ideal for designs that are cost‑conscious but still require PCIe and transceivers; the A50T suits more complex algorithms.

  3. What is the difference between the XC7A35T and the Spartan‑7 XC7S50?
    The Artix‑7 XC7A35T includes 4 GTP transceivers (6.6 Gbps) and a built‑in PCIe Gen2 x4 block, features completely absent from the Spartan‑7 family. The Spartan‑7 XC7S50 offers more logic (52,160 cells) and similar block RAM/DSP but only supports basic parallel I/O. Both are 28 nm, but the Artix‑7 provides higher fabric performance and advanced serial connectivity. Choose the XC7A35T when your design requires gigabit serial links or PCIe; the Spartan‑7 is better for simple, cost‑driven parallel interfaces.

  4. What are the transceiver and PCIe capabilities of the XC7A35T?
    It integrates 4 GTP transceivers that operate from 500 Mbps to 6.6 Gbps, supporting protocols such as Gigabit Ethernet, SATA, DisplayPort, and CPRI. The hardened PCIe Gen2 x4 block can implement a root complex or endpoint without consuming general logic. Even with the “‑2” speed grade, these transceivers perform reliably at their maximum rated speed across the full industrial temperature range, making the device suitable for rugged embedded systems that need high‑bandwidth communication.

  5. How many I/O pins does the FGG484 package provide, and what standards are supported?
    The FGG484 package delivers up to 250 user I/O pins, organized in I/O banks that can be powered independently. Supported standards include LVCMOS (1.2 V–3.3 V), LVDS, SSTL, HSTL, TMDS, and high‑speed differential I/O up to 1.25 Gbps. This flexibility allows the FPGA to directly interface with legacy 3.3 V logic, 2.5 V DDR memory, and modern 1.8 V peripherals, reducing the need for external level shifters in mixed‑voltage systems.

  6. What does the “‑2” speed grade and “I” temperature designation mean?
    The ‑2 is the mid‑range speed grade in the Artix‑7 family, offering a good balance between performance and power. It provides faster switching than the ‑1 in many applications, while still keeping power consumption low. The I indicates an industrial temperature range of ‑40 °C to +100 °C, making this part suitable for outdoor, automotive, and factory‑floor environments. The combination of ‑2 and I is perfect for demanding embedded systems that must operate reliably across wide temperature swings.

  7. What is the typical power consumption of the XC7A35T, and how can I optimize it?
    Static power is typically under 0.5 W, and total on‑chip power for most embedded designs stays well below 3 W. The 28 nm process and advanced power‑gating techniques (such as suspend mode) help achieve excellent performance‑per‑watt. You can further reduce power by using clock gating, optimizing the design for low activity, and leveraging the FPGA's ability to power down unused transceivers or I/O banks.

  8. How do I configure and program the XC7A35T-2FGG484I?
    Like all Artix‑7 FPGAs, it uses SRAM‑based configuration and requires an external non‑volatile memory (SPI flash, BPI flash, or SD card). At power‑up, the FPGA loads its bitstream via SPI, BPI, or SelectMAP interfaces. Debug and programming are done through JTAG. The free AMD Vivado ML Standard Edition fully supports the XC7A35T, including synthesis, implementation, and the integrated logic analyzer. No paid license is required for this device.

  9. Can the XC7A35T drive a display or implement a soft processor like MicroBlaze?
    Absolutely. The 33K logic cells and 90 DSP slices can comfortably host a MicroBlaze soft processor with a full set of peripherals (UART, SPI, I2C, Ethernet, CAN) and still leave room for custom logic. The GTP transceivers and LVDS I/Os can directly implement HDMI, DisplayPort, or LVDS display interfaces. This makes the device ideal for embedded vision, human‑machine interfaces, and industrial controllers that combine processing with high‑speed video or data acquisition.

  10. What are the most typical applications for the XC7A35T-2FGG484I?
    It is widely used in industrial motor control and servo drives, embedded vision systems, software‑defined radio (SDR) front‑ends, automotive ADAS sensor processing, test and measurement instruments, and communication bridges. The combination of PCIe, gigabit transceivers, abundant I/O, and an industrial temperature rating makes it a very popular choice for cost‑sensitive, high‑reliability embedded designs that need more than a microcontroller can offer.

Manufacturer:
AMD Xilinx
Product Family:
Artix-7
Logic Cells:
33,280
Configurable Logic Blocks:
5,200 CLB slices
Block RAM Capacity:
1,800Kbits
DSP Slices:
90
High-Speed Transceivers:
4 GTP up to 6.6Gb/s
User I/O:
250 pins
PCIe Interface:
x4 Gen2 Endpoint and Root Port hard IP
Maximum Frequency:
628 MHz
Process Technology:
28nm HKMG
Core Voltage:
1.0V
I/O Voltage:
1.2V to 3.3V
Temperature Range:
-40°C to 100°C (Industrial Grade)
Package Type:
FCBGA-484 (23×23mm, 1.0mm pitch)
Environmental Compliance:
RoHS 3, Lead free
MSL Level:
3 (168 Hours)
ECCN:
3A991D
Packaging:
Tray, 60 units per tray
Target Applications:
Industrial control, Embedded vision, Communications, Medical imaging, Test measurement
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